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VBQA2412

VBsemi Elec · MOSFETs · DFN5x6-8

VBQA2412 from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET (pin 1 marked by dot); drain-source voltage rating is -40 V.
2 S passive Source terminal of the P-channel MOSFET, tied with pins 1 and 3; continuous source-drain diode current is -35 A at TC = 25 °C.
3 S passive Source terminal of the P-channel MOSFET, tied with pins 1 and 2; pulsed drain current is -70 A (t = 300 µs).
4 G input Gate terminal; gate-source voltage limit is ±20 V with threshold of -1.2 to -2.3 V.
5 D passive Drain terminal, tied with pins 6-8; continuous drain current is -40 A at TC = 25 °C.
6 D passive Drain terminal, tied with pins 5, 7 and 8; RDS(on) max 0.010 Ω at VGS = -10 V.
7 D passive Drain terminal, tied with pins 5, 6 and 8; drain-source voltage rating is -40 V.
8 D passive Drain terminal, tied with pins 5-7; RDS(on) max 0.012 Ω at VGS = -4.5 V.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package DFN5x6-8
Category Transistors/Thyristors
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -40 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -40 A TC = 25 °C (TJ = 150 °C) 1
Continuous Drain Current ID -32 A TC = 70 °C 1
Continuous Drain Current ID -14.6 A TA = 25 °C; notes a, b 1
Continuous Drain Current ID -11.3 A TA = 70 °C; notes a, b 1
Pulsed Drain Current IDM -70 A t = 300 µs 1
Continuous Source-Drain Diode Current IS -35 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -4.3 A TA = 25 °C; notes a, b 1
Avalanche Current IAS -30 A L = 0.1 mH 1
Single-Pulse Avalanche Energy EAS 45 mJ 1
Maximum Power Dissipation PD 39 W TC = 25 °C 1
Maximum Power Dissipation PD 25 W TC = 70 °C 1
Maximum Power Dissipation PD 5 W TA = 25 °C; notes a, b 1
Maximum Power Dissipation PD 3.2 W TA = 70 °C; notes a, b 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Soldering Recommendations (Peak Temperature) 260 °C 1
Maximum Junction-to-Ambient RthJA 20 25 °C/W t = 10 s; notes a, c 1
Maximum Junction-to-Ambient RthJA 54 °C/W Steady state; note f 1
Maximum Junction-to-Case RthJC 2.1 3.2 °C/W Steady state 1
Drain-Source Breakdown Voltage VDS -40 V VGS = 0, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -1.2 -2.3 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -40 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -5 µA VDS = -40 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -30 A VDS ≤ -10 V, VGS = -10 V 2
Drain-Source On-State Resistance RDS(on) 0.01 Ω VGS = -10 V, ID = -15 A 2
Drain-Source On-State Resistance RDS(on) 0.012 Ω VGS = -4.5 V, ID = -10 A 2
Gate Resistance Rg 0.4 1.5 3 Ω f = 1 MHz 2
Total Gate Charge Qg 86 134 nC VDS = -20 V, VGS = -10 V, ID = -10 A 2
Total Gate Charge Qg 42.6 63 nC VDS = -20 V, VGS = -4.5 V, ID = -10 A 2
Turn-On Delay Time td(on) 15 30 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -10 V, Rg = 1 2
Rise Time tr 14 28 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -10 V, Rg = 1 2
Turn-Off Delay Time td(off) 56 110 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -10 V, Rg = 1 2
Fall Time tf 11 22 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -10 V, Rg = 1 2
Turn-On Delay Time td(on) 60 110 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -4.5 V, Rg = 1 2
Rise Time tr 56 110 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -4.5 V, Rg = 1 2
Turn-Off Delay Time td(off) 50 100 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -4.5 V, Rg = 1 2
Fall Time tf 22 40 ns VDD = -20 V, RL = 2, ID -10 A, VGEN = -4.5 V, Rg = 1 2
Continuous Source-Drain Diode Current IS -50 A TC = 25 °C 2
Pulse Diode Forward Current ISM -70 A 2
Body Diode Voltage VSD -0.74 -1.1 V IS = -3 A, VGS = 0 2
Body Diode Reverse Recovery Time trr 29 55 ns IF = -10 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 25 46 nC IF = -10 A, dI/dt = 100 A/µs, TJ = 25 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper d. The DFN5x6 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cann 1

CAD (KiCad official)

  • Symbol: VBQA2412
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN5x6-8 (KiCad packages3D, STEP)
  • 3D model files: vbqa2412-etched.step / vbqa2412-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vbqa2412.step / vbqa2412.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 ec4c846ac1e40dbb, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF