component
VBE1252M
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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VBE1252M
VBsemi Elec · MOSFETs · TO-252
VBE1252M from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET, rated for a gate-source voltage of ±20 V, with an internal gate input resistance Rg of 0.3 to 1.2 Ω. |
| 2 | D | passive | Drain, rated for 250 V drain-source voltage and electrically connected to the tab, with junction-to-case thermal resistance RthJC of 1.0 °C/W maximum. |
| 3 | S | passive | Source, the return path for drain current, with continuous source-drain diode current IS rated at 14 A and internal source inductance LS of 7.5 nH. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 250 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 17 | A | VGS at 10 V, TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 11 | A | VGS at 10 V, TC = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 56 | A | Repetitive rating; pulse width limited by maximum junction temperature (note a) | 1 | ||
| Single Pulse Avalanche Energy | EAS | 550 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 4.5 mH, Rg = 25 Ω, IAS = 14 A (note b) | 1 | ||
| Repetitive Avalanche Current | IAR | 17 | A | Repetitive rating (note a) | 1 | ||
| Repetitive Avalanche Energy | EAR | 13 | mJ | Repetitive rating (note a) | 1 | ||
| Maximum Power Dissipation | PD | 125 | W | TC = 25 °C | 1 | ||
| Linear Derating Factor | 1 | W/°C | 1 | ||||
| Peak Diode Recovery dV/dt | dV/dt | 4.8 | V/ns | Note c: ISD ≤ 14 A, dI/dt ≤ 150 A/µs, VDD ≤ VDS, TJ ≤ 150 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering Recommendations (Peak temperature) | 300 | °C | for 10 s, 1.6 mm from case (note d) | 1 | |||
| Mounting Torque | 10 | lbf·in | 6-32 or M3 screw | 1 | |||
| Mounting Torque | 1.1 | N·m | 6-32 or M3 screw | 1 | |||
| Maximum Junction-to-Ambient | RthJA | 62 | °C/W | 2 | |||
| Maximum Junction-to-Case (Drain) | RthJC | 1 | °C/W | 2 | |||
| Case-to-Sink, Flat, Greased Surface | RthCS | 0.5 | °C/W | Case-to-sink, flat, greased surface | 2 | ||
| Drain-Source Breakdown Voltage | VDS | 250 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 25 | μA | VDS = 250 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 250 | μA | VDS = 200 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.176 | Ω | VGS = 10 V, ID = 8.4 A (note b) | 2 | ||
| Forward Transconductance | gfs | 6.7 | S | VDS = 50 V, ID = 8.4 A (note b) | 2 | ||
| Gate Input Resistance | Rg | 0.3 | 1.2 | Ω | f = 1 MHz, open drain | 2 | |
| Total Gate Charge | Qg | 68 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V, see fig. 6 and 13 (note b) | 2 | ||
| Gate-Source Charge | Qgs | 11 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V | 2 | ||
| Gate-Drain Charge | Qgd | 35 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V | 2 | ||
| Continuous Source-Drain Diode Current | IS | 14 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 | ||
| Pulsed Diode Forward Current | ISM | 56 | A | Note a | 2 | ||
| Body Diode Voltage | VSD | 1.8 | V | TJ = 25 °C, IS = 14 A, VGS = 0 V (note b) | 2 | ||
| Body Diode Reverse Recovery Time | trr | 250 | 500 | ns | TJ = 25 °C, IF = 7.9 A, dI/dt = 100 A/μs (note b) | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 2.3 | 4.6 | μC | 2 | ||
| Input Capacitance | Ciss | 1300 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 | ||
| Output Capacitance | Coss | 330 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 | ||
| Reverse Transfer Capacitance | Crss | 85 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 | ||
| VDS Temperature Coefficient | VDS/TJ | 0.34 | V/°C | Reference to 25 °C, ID = 1 mA | 2 | ||
| Turn-On Delay Time | td(on) | 11 | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 | ||
| Rise Time | tr | 24 | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 | ||
| Turn-Off Delay Time | td(off) | 53 | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 | ||
| Fall Time | tf | 49 | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 | ||
| Internal Drain Inductance | LD | 4.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 | ||
| Internal Source Inductance | LS | 7.5 | nH | 2 |
CAD (KiCad official)
- Symbol:
VBE1252M - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
vbe1252m-etched.step/vbe1252m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);vbe1252m.step/vbe1252m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
d8b6377119efc413, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# VBE1252M
**VBsemi Elec** · MOSFETs · TO-252
VBE1252M from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET, rated for a gate-source voltage of ±20 V, with an internal gate input resistance Rg of 0.3 to 1.2 Ω. |
| 2 | D | passive | Drain, rated for 250 V drain-source voltage and electrically connected to the tab, with junction-to-case thermal resistance RthJC of 1.0 °C/W maximum. |
| 3 | S | passive | Source, the return path for drain current, with continuous source-drain diode current IS rated at 14 A and internal source inductance LS of 7.5 nH. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 250 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | 17 | A | VGS at 10 V, TC = 25 °C | 1 |
| Continuous Drain Current | ID | | | 11 | A | VGS at 10 V, TC = 100 °C | 1 |
| Pulsed Drain Current | IDM | | | 56 | A | Repetitive rating; pulse width limited by maximum junction temperature (note a) | 1 |
| Single Pulse Avalanche Energy | EAS | | | 550 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 4.5 mH, Rg = 25 Ω, IAS = 14 A (note b) | 1 |
| Repetitive Avalanche Current | IAR | | | 17 | A | Repetitive rating (note a) | 1 |
| Repetitive Avalanche Energy | EAR | | | 13 | mJ | Repetitive rating (note a) | 1 |
| Maximum Power Dissipation | PD | | | 125 | W | TC = 25 °C | 1 |
| Linear Derating Factor | | | | 1 | W/°C | | 1 |
| Peak Diode Recovery dV/dt | dV/dt | | | 4.8 | V/ns | Note c: ISD ≤ 14 A, dI/dt ≤ 150 A/µs, VDD ≤ VDS, TJ ≤ 150 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Soldering Recommendations (Peak temperature) | | | | 300 | °C | for 10 s, 1.6 mm from case (note d) | 1 |
| Mounting Torque | | | | 10 | lbf·in | 6-32 or M3 screw | 1 |
| Mounting Torque | | | | 1.1 | N·m | 6-32 or M3 screw | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 62 | °C/W | | 2 |
| Maximum Junction-to-Case (Drain) | RthJC | | | 1 | °C/W | | 2 |
| Case-to-Sink, Flat, Greased Surface | RthCS | | 0.5 | | °C/W | Case-to-sink, flat, greased surface | 2 |
| Drain-Source Breakdown Voltage | VDS | 250 | | | V | VGS = 0 V, ID = 250 μA | 2 |
| Gate-Source Threshold Voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250 μA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VGS = ± 20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 25 | μA | VDS = 250 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 250 | μA | VDS = 200 V, VGS = 0 V, TJ = 125 °C | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 0.176 | | Ω | VGS = 10 V, ID = 8.4 A (note b) | 2 |
| Forward Transconductance | gfs | 6.7 | | | S | VDS = 50 V, ID = 8.4 A (note b) | 2 |
| Gate Input Resistance | Rg | 0.3 | | 1.2 | Ω | f = 1 MHz, open drain | 2 |
| Total Gate Charge | Qg | | | 68 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V, see fig. 6 and 13 (note b) | 2 |
| Gate-Source Charge | Qgs | | | 11 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V | 2 |
| Gate-Drain Charge | Qgd | | | 35 | nC | VGS = 10 V, ID = 7.9 A, VDS = 200 V | 2 |
| Continuous Source-Drain Diode Current | IS | | | 14 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 |
| Pulsed Diode Forward Current | ISM | | | 56 | A | Note a | 2 |
| Body Diode Voltage | VSD | | | 1.8 | V | TJ = 25 °C, IS = 14 A, VGS = 0 V (note b) | 2 |
| Body Diode Reverse Recovery Time | trr | | 250 | 500 | ns | TJ = 25 °C, IF = 7.9 A, dI/dt = 100 A/μs (note b) | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 2.3 | 4.6 | μC | | 2 |
| Input Capacitance | Ciss | | 1300 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 |
| Output Capacitance | Coss | | 330 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 |
| Reverse Transfer Capacitance | Crss | | 85 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | 2 |
| VDS Temperature Coefficient | VDS/TJ | | 0.34 | | V/°C | Reference to 25 °C, ID = 1 mA | 2 |
| Turn-On Delay Time | td(on) | | 11 | | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 |
| Rise Time | tr | | 24 | | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 |
| Turn-Off Delay Time | td(off) | | 53 | | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 |
| Fall Time | tf | | 49 | | ns | VDD = 125 V, ID = 7.9 A, Rg = 9.1 Ω, RD = 8.7 Ω, see fig. 10b | 2 |
| Internal Drain Inductance | LD | | 4.5 | | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
| Internal Source Inductance | LS | | 7.5 | | nH | | 2 |
## CAD (KiCad official)
- Symbol: `VBE1252M`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `vbe1252m-etched.step` / `vbe1252m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `vbe1252m.step` / `vbe1252m.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/vbe1252m-datasheet.pdf) (7 pp, sha256 `d8b6377119efc413`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/vbe1252m-datasheet.pdf)