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GCT USB4135-GF-A

A horizontal (right-angle) surface-mount USB Type-C receptacle for power and charging only. It carries the six contacts a sink needs to draw power from a Type-C source (VBUS, CC1, CC2, GND) and none of the USB 2.0 or SuperSpeed data pairs. Four SMT shell stakes hold it to the board.

Key specifications

Source
Contacts 6: VBUS (A9, B9), CC1 (A5), CC2 (B5), GND (A12, B12) Drawing, pin table
Current rating 3.00 A collectively on VBUS; 4.25 A on GND; 1.25 A VCONN on A5/B5 Spec 4.1
Voltage rating 48 V DC Spec 4.2
Operating temperature -30 to +85 C Spec 4.3
Contact resistance 40 mOhm max, initial Spec 6.1.1
Durability 20,000 cycles Spec 6.2
Materials LCP insulator (UL 94V-0), copper alloy contacts with gold flash, stainless steel shell Drawing
Mating sequence VBUS and GND first, CC second Drawing, pin table

Using it as a power sink

A Type-C source only turns VBUS on after it sees a sink pull-down on a CC line. Put a 5.1 kOhm (Rd) resistor from each of CC1 and CC2 to GND; plug orientation decides which one the source reads. That gets you default USB power (5 V). Negotiating more current or voltage needs a USB PD controller on the CC lines.

Footprint

Pads follow GCT's Recommended PCB Layout (tolerance 0.05 mm): six 1.20 mm long signal pads (0.70 mm wide for CC, 0.76 mm for VBUS, 0.80 mm for GND) and four shell stakes (1.80 x 1.35 mm rear, 1.80 x 1.50 mm front). The mating face points toward +Y in KiCad and is meant to sit at, or overhang, the board edge. The Dwgs.User line marks the front of the shell.

The footprint carries the Adom solder-ball layer (KiCad User.9, named Adom.SolderBalls, EAGLE/Fusion layer 101): 156 jetted 300 um balls at 0.25 mm pitch, 8 per signal pad and 24 or 30 per stake, per john/adom-solder-ball-layer-standard. The positions are also in usb4135-gf-a.solder-balls.json. The layer is hidden by default in the 3D viewer; turn on Solder balls in the layers panel to see them.

3D footprint reference

The page's 3D model is usb4135-gf-a-hero-footprint.glb: the connector plus nonphysical reference artwork on the seating plane, per the Adom component hero contract. Copper pad boundaries are teal dashed outlines at 50% opacity, silkscreen lines are at 30%, and each pad carries its signal name from the GCT pin table at 50% (VBUS, CC1, CC2, GND, SHIELD). Orbit underneath to see the outlines around the contact tails and shell stakes. Each group is its own layer in the viewer's Layers panel. Geometry, hashes and label positions are in usb4135-gf-a-hero-footprint.overlay.json.

These helpers are hero-only. For a board assembly use usb4135-gf-a.glb or the STEP, which carry no footprint artwork.

Files

File What it is
usb4135-gf-a.kicad_sym KiCad symbol, pins named from the GCT pin table
usb4135-gf-a.kicad_mod KiCad footprint with the solder-ball layer
usb4135-gf-a.lbr Fusion 360 / EAGLE library (lint clean, SolderBalls layer 101)
usb4135-gf-a.adom-lbr.json Canonical adom-lbr part (symbol + footprint + pin map)
usb4135-gf-a.step 3D model, Z-up at the footprint origin
usb4135-gf-a.glb Board-use web model with the hidden solder_top layer
usb4135-gf-a-hero-footprint.glb Page model: connector plus dashed pad outlines, silkscreen and signal names
usb4135-gf-a-hero-footprint.overlay.json / hero-pin-map.json Evidence and pin-to-pad names for that artwork
usb4135-gf-a.solder-balls.json Solder-ball positions per pad
docs/usb4135-gf-a-drawing.pdf GCT product drawing
docs/usb4135-product-spec.pdf GCT product specification

Provenance

  • Drawing and product specification downloaded from gct.co on 17 September 2026 (usb4135.pdf md5 c7a4f913..., usb4135-spec.pdf md5 35239e40...).
  • Footprint pads were written from the drawing and match the USB4135-GF-A Fusion library package pad for pad.
  • The 3D body is the USB4135-GF-A v1 model from that Fusion library, taken from a board STEP with its placement transform, so it is already seated and aligned to this footprint. GCT's own STEP download was not reachable from a script (Cloudflare challenge).

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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