component
USB3503T-I
Public Made by Adomby adom
Microchip Tech USB ICs, QFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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USB3503T-I
Microchip Tech · USB ICs · QFN-32-EP(5x5)
USB3503T-I from Microchip Tech, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OCS_N | input | Over Current Sense input from an external current monitor for port 3 or a ganged supply; negated high = no fault, asserted low = over-current fault reported. |
| 2 | HUB_CONNECT | input | Hub moves to the Hub Communication Stage when this pin is asserted high; tie to ground to wait for the connect_n bit, tie to VDD33_BYP for automatic transition, or drive low-to-high, and never drive high in Standby Mode. |
| 3 | NC | unconnected | No connect. |
| 4 | PRTPWR | output | Open-drain port power control output for port 3 or a ganged supply; asserted high = external device should provide power, negated low = external device should disable power. |
| 5 | INT_N | output | Open-drain active-low interrupt whose function is set by CFGP.INTSUSP (general interrupt or USB suspend indication); also sampled during Hub.Init to select primary (high) or secondary (low) REFCLK frequencies, and tied to VDD33_BYP if unused. |
| 6 | VDD12_BYP | power_out | 1.2 V regulator output requiring a 1.0 uF (<1 ohm ESR) capacitor to ground placed as close as possible to the device. |
| 7 | SDA | bidirectional | I2C serial data, open-drain I/O. |
| 8 | SCL | input | I2C serial clock input. |
| 9 | REF_SEL1 | input | Reference clock select 1, tied to ground or VDD33_BYP to match the REFCLK frequency per Table 3-3/3-4 and latched during Hub.Init. |
| 10 | REF_SEL0 | input | Reference clock select 0, tied to ground or VDD33_BYP to match the REFCLK frequency per Table 3-3/3-4 and latched during Hub.Init. |
| 11 | VDD12_BYP | power_out | 1.2 V regulator output requiring a 1.0 uF (<1 ohm ESR) capacitor to ground placed as close as possible to the device. |
| 12 | RESET_N | input | Active-low reset that resets the chip and holds it in low power STANDBY MODE. |
| 13 | VDD12_BYP | power_out | 1.2 V regulator output requiring a 1.0 uF (<1 ohm ESR) capacitor to ground placed as close as possible to the device. |
| 14 | NC | unconnected | No connect. |
| 15 | DATA | bidirectional | Upstream HSIC DATA pin of the hub. |
| 16 | STROBE | bidirectional | Upstream HSIC STROBE pin of the hub. |
| 17 | NC | unconnected | No connect. |
| 18 | NC | unconnected | No connect. |
| 19 | USBDN3_DM | bidirectional | USB downstream port 3 D- data pin; there is no port disable strap option on this port. |
| 20 | USBDN3_DP | bidirectional | USB downstream port 3 D+ data pin; there is no port disable strap option on this port. |
| 21 | USBDN2_DM | bidirectional | USB downstream port 2 D- data pin; sampled at RESET_N negation and tied with D+ to VDD33_BYP to disable the port. |
| 22 | USBDN2_DP | bidirectional | USB downstream port 2 D+ data pin; sampled at RESET_N negation and tied with D- to VDD33_BYP to disable the port. |
| 23 | USBDN1_DM | bidirectional | USB downstream port 1 D- data pin; sampled at RESET_N negation and tied with D+ to VDD33_BYP to disable the port. |
| 24 | USBDN1_DP | bidirectional | USB downstream port 1 D+ data pin; sampled at RESET_N negation and tied with D- to VDD33_BYP to disable the port. |
| 25 | VBAT | power_in | Battery power supply input; see Section 9.0 for power supply configuration options. |
| 26 | VDD33_BYP | power_out | 3.3 V regulator output requiring a 4.7 uF (<1 ohm ESR) capacitor to ground placed as close as possible to the device. |
| 27 | NC | unconnected | No connect. |
| 28 | VDD_CORE_REG | power_in | Power supply input to the 1.2 V regulator for the digital core; connect to VDD33_BYP for single supply applications. |
| 29 | REFCLK | input | Reference clock input driven with a square wave from 0 V to VDD33_BYP, using only the positive edge, with peak-to-peak jitter under 1 ns over 10 s. |
| 30 | RBIAS | passive | Analog pin for a 12.0 kohm (+/-1%) resistor to ground that sets the USB transceiver internal bias. |
| 31 | NC | unconnected | No connect. |
| 32 | VDD33_BYP | power_out | 3.3 V regulator output requiring a 4.7 uF (<1 ohm ESR) capacitor to ground placed as close as possible to the device. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-32-EP(5x5) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VBAT absolute max | VBAT | -0.5 | 5.5 | V | 51 | ||
| VDD_CORE_REG absolute max | VDD_CORE_REG | -0.5 | 4.6 | V | 51 | ||
| VDD33 absolute max | VDD33_BYP | -0.5 | 4.6 | V | 51 | ||
| Maximum IO Voltage to Ground | VIO | -0.5 | 4.6 | V | 51 | ||
| REFCLK Voltage | VMAX_REFCLK | -0.5 | 3.6 | V | 51 | ||
| Voltage on USB+ and USB- pins | VMAX_USB | -0.5 | 5.5 | V | 51 | ||
| Operating Temperature (Industrial) | TMAX_OP | -40 | 85 | °C | Industrial | 51 | |
| Storage Temperature | TMAX_STG | -55 | 150 | °C | 51 | ||
| Junction Temperature | TJMAX | 125 | °C | 51 | |||
| VBAT supply | VBAT | 2.9 | 5.5 | V | 51 | ||
| VDD_CORE_REG (external supply) | VDD_CORE_REG | 1.6 | 1.8 | 2 | V | Note 10-1 | 51 |
| VDD_CORE_REG (tied to VDD33_BYP) | VDD_CORE_REG | 3 | 3.3 | 3.6 | V | Note 10-2 | 51 |
| Input Voltage (DP, DM) | VIUSB | -0.3 | 5.5 | V | 51 | ||
| Input Voltage (STROBE, DATA) | VIHSIC | -0.3 | 1.2 | 1.32 | V | 51 | |
| Input Voltage on I/O Pins | VI | -0.3 | 1.8 | 3.6 | V | 51 | |
| Voltage on REFCLK | VREFCLK | -0.3 | 3.6 | V | 51 | ||
| Ambient Temperature (Industrial) | TA | -40 | 85 | °C | Industrial | 51 | |
| Thermal resistance junction to ambient, 32-pin SQFN | 44 | °C/W | Measured in still air | 52 | |||
| Thermal resistance junction to bottom of case, 32-pin SQFN | 0.6 | °C/W | Measured in still air | 52 | |||
| Thermal resistance junction to top of case, 32-pin SQFN | 6.3 | °C/W | 52 | ||||
| Operating current VBAT, HS, 3 ports active (dual supply) | IVBAT(HS) | 55 | 65 | 68 | mA | Active USB Transfer, RESET_N = 1, 3 Downstream Ports Active | 52 |
| Standby current VBAT, industrial (dual supply) | IVBAT(STDBY) | 0 | 0.6 | 3.9 | µA | RESET_N = 0, Industrial Temp | 53 |
| Standby current core, industrial (dual supply) | ICORE(STDBY) | 0 | 0 | 0.9 | µA | RESET_N = 0, Industrial Temp | 53 |
| Suspend current VBAT, industrial (dual supply) | IVBAT(SPND) | 65 | 73 | 125 | µA | USB Suspend, Industrial Temp | 53 |
| Suspend current core, industrial (dual supply) | ICORE(SPND) | 125 | 165 | 1050 | µA | USB Suspend, Industrial Temp | 53 |
| Operating current VBAT, HS, 3 ports active (single supply) | IVBAT(HS) | 88 | 98 | 110 | mA | Active USB Transfer, RESET_N = 1, 3 Downstream Ports Active | 53 |
| Standby current VBAT, industrial (single supply) | IVBAT(STDBY) | 0 | 0.6 | 3.1 | µA | RESET_N = 0, Industrial Temp | 53 |
| Low-Level Input Voltage (I2C pullups < 2.1V) | VIL | -0.3 | 0.42 | V | Note 10-1 | 54 | |
| Low-Level Input Voltage (I2C pullups > 2.1V) | VIL | -0.3 | 0.34 | V | Note 10-2 | 54 | |
| High-Level Input Voltage | VIH | 1.25 | V | Upper limit VDD33_BYP+0.3V | 54 | ||
| Low-Level Input Voltage RESET | VIL_RST | -0.3 | 0.38 | V | 54 | ||
| High-Level Input Voltage RESET | VIH_RST | 1 | V | Upper limit VDD33_BYP+0.3V | 54 | ||
| Low-Level Input Voltage OSC | VIL_OSC | -0.3 | 0.55 | V | 54 | ||
| High-Level Input Voltage OSC | VIH_OSC | 0.8 | V | Upper limit VDD33_BYP+0.3V | 54 | ||
| Low-Level Input Voltage REFCLK | VIL_REF | -0.3 | 0.5 | V | 54 | ||
| High-Level Input Voltage REFCLK | VIH_REF | 1.4 | V | Upper limit VDD33_BYP+0.3V | 54 | ||
| Clock Input Capacitance REFCLK | CIN | 2 | pF | 54 | |||
| Low-Level Output Voltage | VOL | 0.4 | V | @ IOL=12mA sink current | 54 | ||
| Pin Capacitance | Cpin | 2 | 20 | pF | 54 | ||
| Output Current Capability | IO | 12 | 20 | 24 | mA | 54 | |
| Differential Receiver Input Sensitivity | VDIFS | 0.2 | V | / V(DP) - V(DM) / | 55 | ||
| Differential Receiver Common-Mode Voltage | VCMFS | 0.8 | 2.5 | V | 55 | ||
| Single-Ended Receiver Low Level Input Voltage | VILSE | 0.8 | V | 55 | |||
| Single-Ended Receiver High Level Input Voltage | VIHSE | 2 | V | 55 | |||
| Low Level Output Voltage | VFSOL | 0.3 | V | Pull-up resistor on DP; RL = 1.5kΩ to VDD33_BYP | 55 | ||
| High Level Output Voltage | VFSOH | 2.8 | 3.6 | V | Pull-down resistor on DP, DM; RL = 15kΩ to GND | 55 | |
| Driver Output Impedance for HS | ZHSDRV | 40.5 | 45 | 49.5 | Ω | Steady state drive | 55 |
| Input Impedance | ZINP | 1 | MΩ | RX, RPU, RPD disabled | 55 | ||
| Pull-dn Resistor Impedance | RPD | 14.25 | 16.9 | 20 | kΩ | Note 10-3 | 55 |
| HS Differential Input Sensitivity | VDIHS | 100 | mV | / V(DP) - V(DM) / | 55 | ||
| HS Squelch Detection Threshold (Differential) | VHSSQ | 100 | 150 | mV | 55 | ||
| HS Disconnect Threshold | VHSDSC | 525 | 625 | mV | 55 | ||
| HS High Level Output Voltage | VHSOH | 360 | 440 | mV | 45Ω load | 55 | |
| OFF-State Leakage Current | ILZ | -10 | 10 | µA | 55 | ||
| Regulator Output Voltage VDD33 | VDD33 | 2.8 | 3.3 | 3.6 | V | 5.5V > VBAT > 2.9V | 56 |
| Regulator Output Voltage VDD12 | VDD12 | 1.1 | 1.2 | 1.3 | V | 3.6V > VDD33 > 2.8V | 56 |
| Minimum Active Low Pulse on RESET_N | TRESET | 1 | ms | RESET_N = '0' | 56 | ||
| Hub Configuration Time-out | THUBCONFIG | 94 | 95 | 96 | ms | 18 |
CAD (KiCad official)
- Symbol:
USB3503T-I - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
usb3503t-i-etched.step/usb3503t-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);usb3503t-i.step/usb3503t-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (74 pp, sha256
262b302459ecd7f2, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).