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USB2422-I
Public Made by Adomby adom
Microchip Tech USB ICs, QFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUSB2422-I
Microchip Tech · USB ICs · QFN-24-EP(4x4)
USB2422-I from Microchip Tech, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD33 | power_in | 3.3 V power to the chip; a 0.1 µF low-ESR capacitor to VSS is required as close as possible to the pin. |
| 2 | USBDM_DN1/PRT_DIS_M1 | bidirectional | Downstream port 1 Hi-Speed USB data minus, also port disable strap sampled at RESET_N negation (both port data pins tied to VDD33 disable the port). |
| 3 | USBDP_DN1/PRT_DIS_P1 | bidirectional | Downstream port 1 Hi-Speed USB data plus, also port disable strap sampled at RESET_N negation (both port data pins tied to VDD33 disable the port). |
| 4 | USBDM_DN2/PRT_DIS_M2 | bidirectional | Downstream port 2 Hi-Speed USB data minus, also port disable strap sampled at RESET_N negation (both port data pins tied to VDD33 disable the port). |
| 5 | USBDP_DN2/PRT_DIS_P2 | bidirectional | Downstream port 2 Hi-Speed USB data plus, also port disable strap sampled at RESET_N negation (both port data pins tied to VDD33 disable the port). |
| 6 | NC | unconnected | Treat as a no-connect pin or connect to ground; no trace or signal should be routed or attached to it. |
| 7 | PRTPWR1/BC_EN1 | output | Port 1 USB power enable (O12, active-high power controllers only); also battery charging strap (internal pull-down) sampled at RESET_N negation, 1 enables battery charging on port 1. |
| 8 | OCS1_N | input | Port 1 over-current sense input from external current monitor, with internal pull-up to the 3.3 V supply. |
| 9 | VDD33 | power_in | 3.3 V power to the chip; a 1.0 µF low-ESR capacitor to VSS is required as close as possible to the pin. |
| 10 | CRFILT | passive | Core regulator filter capacitor pin; requires a 1.0 µF low-ESR capacitor to VSS. |
| 11 | PRTPWR2 | output | Port 2 USB power enable (O12, active-high power controllers only). |
| 12 | OCS2_N | input | Port 2 over-current sense input from external current monitor, with internal pull-up to the 3.3 V supply. |
| 13 | SMBDATA/NON_REM1 | bidirectional | SMBus data (I/OSD12), also non-removable port strap NON_REM1 sampled with NON_REM0 at RESET_N negation. |
| 14 | SMBCLK/CFG_SEL0 | bidirectional | SMBus clock (I/OSD12), also configuration select latched on RESET_N negation: 0 = default strap configuration, 1 = configured over SMBus. |
| 15 | RESET_N | input | Schmitt-trigger reset input, active low; the minimum active low pulse is 1 µs. |
| 16 | VBUS_DET | input | Detects upstream VBUS power to decide when to assert the internal D+ pull-up; connect to VBUS via a 2:1 divider (two 100 kΩ suggested) or to a host control output/VDD33 for self-powered use. |
| 17 | SUSP_IND/LOCAL_PWR/NON_REM0 | bidirectional | Suspend indicator (I/O12) or local power input when configured via SMBus, and non-removable strap NON_REM0 sampled at RESET_N negation; never tie directly to VDD33. |
| 18 | VDD33 | power_in | 3.3 V power to the chip. |
| 19 | USBDM_UP | bidirectional | Upstream USB data minus; connect to the upstream USB bus (host, port, or upstream hub). |
| 20 | USBDP_UP | bidirectional | Upstream USB data plus; connect to the upstream USB bus (host, port, or upstream hub). |
| 21 | XTALOUT | output | Crystal output with 1.2 V p-p and weak (<1 mA) drive; leave unconnected when an external clock drives XTALIN/CLKIN. |
| 22 | XTALIN/CLKIN | input | 24 MHz crystal terminal or external 24 MHz clock input when no crystal is used. |
| 23 | PLLFILT | passive | PLL regulator filter capacitor pin; can have up to a 0.1 µF low-ESR capacitor to VSS or be left unconnected. |
| 24 | RBIAS | passive | USB transceiver bias; a 12.0 kΩ (+/-1%) resistor is attached from ground to this pin. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-24-EP(4x4) |
| Category | Interface ICs |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | TSTOR | -55 | 150 | °C | 35 | ||
| 3.3 V supply voltage (absolute maximum) | VDD33 | 4.6 | V | 35 | |||
| Voltage on any I/O pin (absolute maximum) | -0.5 | 5.5 | V | 35 | |||
| Voltage on XTALIN (absolute maximum) | -0.5 | 4 | V | 35 | |||
| Voltage on XTALOUT (absolute maximum) | -0.5 | 2.5 | V | 35 | |||
| USB2422-i Operating Temperature | TA | -40 | 85 | °C | Ambient temperature in still air | 35 | |
| 3.3 V supply voltage | VDD33 | 3 | 3.6 | V | 35 | ||
| 3.3 V supply rise time | tRT33 | 0 | 400 | μs | See Figure 5-1 | 35 | |
| Voltage on any I/O pin (recommended) | -0.3 | 5.5 | V | If any 3.3 V supply drops below 3.0 V, MAX becomes (3.3 V supply voltage) + 0.5 | 35 | ||
| Voltage on XTALIN (recommended) | -0.3 | V | Printed max is VDD12 + 0.3 (not a numeric value in the text) | 35 | |||
| I, IS input buffer low input level | VILI | 0.8 | V | TTL levels | 36 | ||
| I, IS input buffer high input level | VIHI | 2 | V | 36 | |||
| I, IS input leakage | IIL | -10 | 10 | μA | VIN = 0 to VDD33 | 36 | |
| IS input hysteresis | VHYSI | 250 | 350 | mV | IS only | 36 | |
| IPU input buffer low input level | VILI | 0.8 | V | TTL levels | 36 | ||
| IPU input buffer high input level | VIHI | 2 | V | 36 | |||
| IPU input buffer low input leakage | IILL | 35 | 90 | μA | VIN = 0 | 36 | |
| IPU input buffer high input leakage | IIHL | -10 | 10 | μA | VIN = VDD33 | 36 | |
| IPD input buffer low input level | VILI | 0.8 | V | TTL levels | 36 | ||
| IPD input buffer high input level | VIHI | 2 | V | 36 | |||
| IPD input buffer low input leakage (as printed +10 / -10) | IILL | 10 | -10 | μA | VIN = 0 | 36 | |
| IPD input buffer high input leakage (as printed) | IIHL | -35 | -90 | μA | VIN = VDD33 | 36 | |
| ICLK input buffer low input level | VILCK | 0.3 | V | 36 | |||
| ICLK input buffer high input level | VIHCK | 0.9 | V | 36 | |||
| ICLK input leakage | IIL | -10 | 10 | μA | VIN = 0 to VDD33 | 36 | |
| O12, I/O12, I/OSD12 low output level | VOL | 0.4 | V | IOL = 12 mA @ VDD33 = 3.3 V | 37 | ||
| O12, I/O12, I/OSD12 high output level | VOH | 2.4 | V | IOH = -12 mA @ VDD33 = 3.3 V | 37 | ||
| O12, I/O12, I/OSD12 output leakage | IOL | -10 | 10 | μA | 37 | ||
| SD pad hysteresis | VHYSC | 250 | 350 | mV | VIN = VDD33 | 37 | |
| Supply current, unconfigured, Hi-Speed host | ICCINTHS | 40 | 45 | mA | 37 | ||
| Supply current, Hi-Speed host, each additional downstream port | ICCINTFS | 35 | 40 | mA | Note 5-8: peak USB traffic, not average draw | 37 | |
| Supply current, Hi-Speed host, 1 downstream port | IHCH1 | 47 | 58 | mA | Note 5-8: peak USB traffic, not average draw | 37 | |
| Supply current, Hi-Speed host, 2 downstream ports | IHCH2 | 70 | 89 | mA | Note 5-8: peak USB traffic, not average draw | 37 | |
| Supply current, Full-Speed host, 1 downstream port | IFCC1 | 29 | 40 | mA | Note 5-8: peak USB traffic, not average draw | 37 | |
| Supply current, Full-Speed host, 2 downstream ports | IFCC2 | 35 | 45 | mA | Note 5-8: peak USB traffic, not average draw | 37 | |
| Supply current, suspend | ICSBY | 425 | 1200 | μA | Note 5-6: 1200 μA for industrial temperature part | 37 | |
| Supply current, reset | ICRST | 300 | 1000 | μA | Note 5-7: 1000 μA for industrial temperature part | 37 | |
| Clock input capacitance | CXTAL | 6 | pF | All pins except USB pins and the pins under the test tied to AC ground | 37 | ||
| Input capacitance | CIN | 6 | pF | TA = 25°C, fc = 1 MHz, VDD33 = 3.3 V | 37 | ||
| Output capacitance | COUT | 6 | pF | 37 | |||
| Crystal frequency tolerance (24 MHz) | -350 | 350 | ppm | External crystal, parallel resonant, fundamental mode, 24 MHz | 38 | ||
| External clock frequency tolerance (24 MHz) | -350 | 350 | ppm | External 24 MHz clock input | 39 | ||
| External clock duty cycle tolerance | -10 | 10 | % | External clock, 50% nominal duty cycle | 39 | ||
| Hub configuration: RESET_N assertion time | t1 | 1 | μsec | Minimum of 1 μs after power supplies are within operating range | 17 | ||
| Hub configuration: strap setup time | t2 | 16.7 | nsec | 17 | |||
| Hub configuration: strap hold time | t3 | 16.7 | 1400 | nsec | 17 | ||
| Hub configuration: hub outputs driven to inactive states | t4 | 1.5 | 2 | μsec | 17 | ||
| Hub configuration: USB attach | t5 | 3 | μsec | See Note: all supplies at operating levels before or at RESET_N assertion | 17 | ||
| Hub configuration: host acknowledges attach and signals USB reset | t6 | 100 | msec | 17 | |||
| Hub configuration: completion time for requests | t8 | 5 | msec | With or without data stage | 17 |
CAD (KiCad official)
- Symbol:
USB2422-I - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
usb2422-i-etched.step/usb2422-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);usb2422-i.step/usb2422-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (47 pp, sha256
4a9ad71cd6535368, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).