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US3MBG
Public Made by Adomby adom
Shikues Fast Recovery / High Efficiency Diodes, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUS3MBG
Shikues · Fast Recovery / High Efficiency Diodes · SMB
US3MBG from Shikues, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the surface mount ultrafast recovery rectifier; the datasheet gives a maximum repetitive peak reverse voltage of 1000 V for the US3MB rating. |
| 2 | Anode | passive | Anode terminal of the surface mount ultrafast recovery rectifier, which conducts forward current with a maximum average forward rectified current of 3.0 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shikues |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 1000 | V | 1 | |||
| Maximum RMS Voltage | VRMS | 700 | V | 1 | |||
| Maximum DC Blocking Voltage | VDC | 1000 | V | 1 | |||
| Maximum Average Forward Rectified Current | IF(AV) | 3 | A | Single phase half-wave 60 Hz, resistive or inductive load | 1 | ||
| Peak Forward Surge Current | IFSM | 90 | A | 8.3 ms single half sine wave superimposed on rated load (JEDEC method) | 1 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.3 | V | at 3 A | 1 | ||
| Maximum DC Reverse Current at 25 °C | IR | 5 | μA | Ta = 25 °C, at rated DC blocking voltage | 1 | ||
| Maximum DC Reverse Current at 125 °C | IR | 100 | μA | Ta = 125 °C, at rated DC blocking voltage | 1 | ||
| Maximum Reverse Recovery Time | trr | 75 | ns | Measured with IF = 0.5 A, IR = 1 A, Irr = 0.25 A | 1 | ||
| Operating and Storage Temperature Range | Tj, Tstg | -55 | 150 | °C | 1 | ||
| Typical Thermal Resistance Junction-to-Ambient | RθJA | 45 | °C/W | P.C.B. mounted with 2.0" x 2.0" (5 x 5 cm) copper pad areas | 1 | ||
| Typical Thermal Resistance Junction-to-Case | RθJC | 15 | °C/W | 1 |
CAD (KiCad official)
- Symbol:
US3MBG - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
us3mbg-etched.step/us3mbg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);us3mbg.step/us3mbg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shikues datasheet (3 pp, sha256
54f8c313859dc662, retrieved 2026-10-13, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).