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Contents

README

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US3MB

Shandong Jingdao Microelectronics · Diodes - Fast Recovery Rectifiers · SMB

US3MB from Shandong Jingdao Microelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the US3MB rectifier diode; the datasheet gives no pin-specific electrical limits beyond the device ratings.
2 Anode passive Anode terminal of the US3MB rectifier diode; the datasheet gives no pin-specific electrical limits beyond the device ratings.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 1000 V US3MB column 1
Maximum RMS Voltage VRMS 700 V US3MB column 1
Maximum DC Blocking Voltage VDC 1000 V US3MB column 1
Maximum Average Forward Rectified Current IF(AV) 3 A Single phase half-wave 60 Hz, resistive or inductive load 1
Peak Forward Surge Current IFSM 90 A 8.3 ms single half sine wave superimposed on rated load (JEDEC method) 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Maximum Instantaneous Forward Voltage VF 1.3 V at 3 A 1
Maximum DC Reverse Current IR 5 µA Ta = 25 °C, at rated DC blocking voltage 1
Maximum DC Reverse Current IR 100 µA Ta = 125 °C, at rated DC blocking voltage 1
Maximum Reverse Recovery Time trr 75 ns IF = 0.5 A, IR = 1 A, Irr = 0.25 A 1
Typical Thermal Resistance, junction to ambient RθJA 45 °C/W P.C.B. mounted with 2.0 x 2.0 in (5 x 5 cm) copper pad areas 1
Typical Thermal Resistance, junction to case RθJC 15 °C/W 1

CAD (KiCad official)

  • Symbol: US3MB
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: us3mb-etched.step / us3mb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us3mb.step / us3mb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 2ae7b42c4e442220, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF