component
US3JC
Public Made by Adomby adom
XCH Fast Recovery / High Efficiency Diodes, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUS3JC
XCH · Fast Recovery / High Efficiency Diodes · SMC
US3JC from XCH, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XCH |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage (US3JC column) | VRRM | 600 | V | 1 | |||
| Maximum RMS Voltage (US3JC column) | VRMS | 420 | V | 1 | |||
| Maximum DC Blocking Voltage (US3JC column) | VDC | 600 | V | 1 | |||
| Maximum Average Forward Rectified Current | IF(AV) | 3 | A | 1 | |||
| Peak Forward Surge Current | IFSM | 90 | A | 8.3 ms single half sine wave superimposed on rated load | 1 | ||
| Operating and Storage Temperature Range | Tj, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.3 | V | at IF = 3 A | 1 | ||
| Maximum DC Reverse Current | IR | 5 | μA | TA = 25 °C, at rated DC blocking voltage | 1 | ||
| Maximum DC Reverse Current | IR | 100 | μA | TA = 125 °C, at rated DC blocking voltage | 1 | ||
| Maximum Reverse Recovery Time | trr | 75 | ns | IF = 0.5 A, IR = 1 A, Irr = 0.25 A | 1 | ||
| Typical Thermal Resistance, junction to ambient | RθJA | 45 | °C/W | P.C.B. mounted with 2.0" x 2.0" (5 x 5 cm) copper pad areas | 1 | ||
| Typical Thermal Resistance, junction to case | RθJC | 15 | °C/W | 1 |
CAD (KiCad official)
- Symbol:
US3JC - Footprint:
Diode_SMD:D_SMC - 3D model: SMC (KiCad packages3D, STEP)
- 3D model files:
us3jc-etched.step/us3jc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);us3jc.step/us3jc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XCH datasheet (3 pp, sha256
48ad99c41194dba0, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).