# US3DCG

**Shikues** · Diodes - Fast Recovery Rectifiers · SMC

US3DCG from Shikues, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the surface-mount ultrafast recovery rectifier; the datasheet gives no pin-specific electrical limit. |
| 2 | Anode | passive | Anode terminal of the surface-mount ultrafast recovery rectifier; the datasheet gives no pin-specific electrical limit. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shikues |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 3 | A |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 90 | A | 8.3 ms single half sine wave superimposed on rated load (JEDEC method) | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1.3 | V | at 3 A | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | μA | at rated DC blocking voltage, TA = 25 °C | 1 |
| Maximum DC Reverse Current | IR |  |  | 100 | μA | at rated DC blocking voltage, TA = 125 °C | 1 |
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 200 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 140 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 200 | V |  | 1 |
| Operating and Storage Temperature Range | Tj, Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance, junction to ambient | RθJA |  | 45 |  | °C/W |  | 1 |
| Typical Thermal Resistance, junction to case | RθJC |  | 15 |  | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `US3DCG`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `us3dcg-etched.step` / `us3dcg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `us3dcg.step` / `us3dcg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shikues datasheet](docs/us3dcg-datasheet.pdf) (3 pp, sha256 `b1fb1cabab6f6776`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/us3dcg-datasheet.pdf)