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Contents

README

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US3DB

LangJie · Fast Recovery / High Efficiency Diodes · DO-214AA

US3DB from LangJie, in a DO-214AA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the laser band on the DO-214AA body; the 200 V US3DB blocks reverse voltage up to VRRM/VDC 200 V at this terminal.
2 A passive Anode terminal, opposite the laser band; carries up to 3.0 A average forward current (IF(AV) at TA=100℃) for the US3DB.

Key specifications

Parameter Value
Manufacturer LangJie
Package DO-214AA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 200 Volts 1
Maximum RMS Voltage VRMS 140 Volts 1
Maximum DC Blocking Voltage VDC 200 Volts 1
Maximum Average Forward Rectified Current I(AV) 3 Amps TA=100℃ 1
Peak Forward Surge Current IFSM 80 Amps 8.3ms single half sine wave superimposed on rated load (JEDEC Method) 1
Maximum Instantaneous Forward Voltage VF 1 Volts at 3.0A 1
Maximum DC Reverse Current IR 5 µA TA = 25℃, rated DC blocking voltage 1
Maximum DC Reverse Current IR 100 µA TA = 125℃, rated DC blocking voltage 1
Maximum Reverse Recovery Time TRR 50 nS If=0.5A, Ir=1.0A, Irr=0.25A 1
Operating Junction Temperature TJ -55 150 ℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Typical Junction Capacitance CJ 50 pF Measured at 1.0MHz and applied reverse voltage of 4.0V 1
Typical Thermal Resistance, junction to ambient RθJA 70 ℃/W Unit mounted on P.C.B. with 0.3×0.3″(8.0 × 8.0mm) copper pads 1
Typical Thermal Resistance, junction to lead RθJL 28 ℃/W Unit mounted on P.C.B. with 0.3×0.3″(8.0 × 8.0mm) copper pads 1

CAD (KiCad official)

  • Symbol: US3DB
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA (KiCad packages3D, STEP)
  • 3D model files: us3db-etched.step / us3db-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us3db.step / us3db.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LangJie datasheet (6 pp, sha256 791e2454b0f6cc4c, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF