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Contents

README

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US2DA

onsemi · Diodes - Fast Recovery Rectifiers · SMA(DO-214AC)

US2DA from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the rectifier, identified by the color band on the SMA/DO-214AC body; the junction-to-lead thermal resistance of 31 °C/W is referenced to this pin.
2 Anode passive Anode terminal of the rectifier; US2DA is rated for 200 V repetitive peak reverse voltage and 1.5 A average forward rectified current.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive Peak Reverse Voltage VRRM 200 V 2
RMS Reverse Voltage VRMS 140 V 2
DC Blocking Voltage VDC 200 V 2
Average Forward Rectified Current IF(AV) 1.5 A 2
Peak Forward Surge Current IFSM 50 A 8.3 ms single half-sine wave, superimposed on rated load 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Maximum Instantaneous Forward Voltage VF 1 V at rated IF(AV), TA = 25°C, pulse test PW = 300 µs, 1% duty cycle 2
Maximum Reverse Current IR 5 µA at rated VR, TJ = 25°C 2
Maximum Reverse Current IR 100 µA at rated VR, TJ = 125°C 2
Maximum Reverse Recovery Time trr 50 ns IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A 2
Typical Junction Capacitance CJ 50 pF 1 MHz, applied reverse voltage 4.0 V DC 2
Typical Thermal Resistance, Junction-to-Ambient RθJA 189 °C/W Device mounted at minimum pad 2
Typical Thermal Characteristics, Junction-to-Lead ψJL 31 °C/W with reference to cathode pin; device mounted at minimum pad 2

CAD (KiCad official)

  • Symbol: US2DA
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: us2da-etched.step / us2da-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us2da.step / us2da.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 042650c3157e53ed, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF