US1J HR3G
Public Made by Adomby adom
Taiwan Semiconductor Fast Recovery / High Efficiency Diodes, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownUS1J HR3G
Taiwan Semiconductor · Fast Recovery / High Efficiency Diodes · SMA(DO-214AC)
US1J HR3G from Taiwan Semiconductor, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage | VF | 1.7 | V | IF = 1A, TJ = 25°C | 2 | ||
| Reverse current @ rated VR | IR | 5 | µA | TJ = 25°C | 2 | ||
| Reverse current @ rated VR | IR | 150 | µA | TJ = 125°C | 2 | ||
| Reverse recovery time | trr | 75 | ns | IF = 0.5A, IR = 1.0A, Irr = 0.25A | 2 | ||
| Repetitive peak reverse voltage | VRRM | 600 | V | TA = 25°C | 1 | ||
| Reverse voltage, total rms value | VR(RMS) | 420 | V | TA = 25°C | 1 | ||
| Forward current | IF | 1 | A | TA = 25°C | 1 | ||
| Peak forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load | 1 | ||
| Junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 | ||
| Junction capacitance | CJ | 10 | pF | 1MHz, VR = 4.0V | 2 | ||
| Junction-to-lead thermal resistance | RӨJL | 27 | °C/W | 2 | |||
| Junction-to-ambient thermal resistance | RӨJA | 75 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
CAD (KiCad official)
- Symbol:
US1J HR3G - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
us1j-hr3g-etched.step/us1j-hr3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);us1j-hr3g.step/us1j-hr3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (6 pp, sha256
d28e876b02579c8a, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).