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US1GA

FUXINSEMI · High Effic Rectifier · SMA(DO-214AC)

US1GA from FUXINSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, marked by the color band on the package; the datasheet rates US1GA at a maximum repetitive peak reverse voltage (VRRM) of 400 V and a maximum average forward rectified current of 1.0 A at TL=100°C.
2 Anode passive Anode terminal, opposite the cathode band; the datasheet specifies a maximum instantaneous forward voltage of 1.4 V at 1.0 A and a peak forward surge current of 30.0 A (8.3 ms half sine-wave).

Key specifications

Parameter Value
Manufacturer FUXINSEMI
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 400 V US1GA column 1
Maximum RMS voltage VRMS 280 V US1GA column 1
Maximum DC blocking voltage VDC 400 V US1GA column 1
Maximum average forward rectified current I(AV) 1 A at TL=100 C 1
Peak forward surge current IFSM 30 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum instantaneous forward voltage VF 1.4 V at 1.0A 1
Maximum DC reverse current IR 5 µA TA=25 C, at rated DC blocking voltage 1
Maximum DC reverse current IR 50 µA TA=100 C, at rated DC blocking voltage 1
Typical junction capacitance CJ 15 pF Measured at 1MHz and applied reverse voltage of 4.0V D.C. 1
Typical thermal resistance RθJA 75 C/W P.C.B. mounted with 0.2x0.2in (5.0x5.0mm) copper pad areas 1
Operating junction and storage temperature range TJ,TSTG -55 150 C 1

CAD (KiCad official)

  • Symbol: US1GA
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: us1ga-etched.step / us1ga-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us1ga.step / us1ga.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUXINSEMI datasheet (4 pp, sha256 08c0d812e5368820, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF