component

US1AFA

Public Made by Adom

by adom

onsemi Fast Recovery / High Efficiency Diodes, SOD-123FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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US1AFA

onsemi · Fast Recovery / High Efficiency Diodes · SOD-123FL

US1AFA from onsemi, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the SOD-123FL package for the US1AFA, which is rated for 50 V repetitive peak reverse voltage (VRRM) and 1 A average forward rectified current (IF(AV)).
2 Anode passive Anode terminal of the SOD-123FL package for the US1AFA, which is rated for 50 V VRRM and 1 A average forward rectified current (IF(AV)).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Instantaneous Forward Voltage VF 0.95 V IF = 1 A 2
Maximum Reverse Current at Rated VR IR 5 µA TJ = 25°C 2
Maximum Reverse Current at Rated VR IR 150 µA TJ = 125°C 2
Maximum Reverse Recovery Time Trr 50 ns IF = 0.5 A, IR = 1 A, Irr = 0.25 A 2
Repetitive Peak Reverse Voltage VRRM 50 V 2
RMS Reverse Voltage VRMS 35 V 2
DC Blocking Voltage VR 50 V 2
Average Forward Rectified Current IF(AV) 1 A 2
Peak Forward Surge Current IFSM 30 A 8.3 ms Single Half Sine-Wave Superimposed on Rated Load 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Typical Thermal Resistance, Junction to Lead RθJL 21 °C/W 2
Typical Thermal Resistance, Junction to Ambient RθJA 153 °C/W Device mounted at minimum pad 2

CAD (KiCad official)

  • Symbol: US1AFA
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: us1afa-etched.step / us1afa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us1afa.step / us1afa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 e4c07a447066c43d, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF