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UM213EEASR
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Union Semiconductor RS232 ICs, SSOP-28. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUM213EEASR
Union Semiconductor · RS232 ICs · SSOP-28
UM213EEASR from Union Semiconductor, in a SSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TOUT3 | output | RS-232 driver 3 output, protected to ±15kV ESD. |
| 2 | TOUT1 | output | RS-232 driver 1 output, protected to ±15kV ESD. |
| 3 | TOUT2 | output | RS-232 driver 2 output, protected to ±15kV ESD. |
| 4 | RIN2 | input | RS-232 receiver 2 input, tolerates ±30V and protected to ±15kV ESD. |
| 5 | ROUT2 | tri_state | Receiver 2 TTL/CMOS output, high-impedance in shutdown or when EN is low. |
| 6 | TIN2 | input | Driver 2 TTL/CMOS input, logic low below 0.8V and high above 2.4V. |
| 7 | TIN1 | input | Driver 1 TTL/CMOS input, logic low below 0.8V and high above 2.4V. |
| 8 | R1OUT | tri_state | Receiver 1 TTL/CMOS output, high-impedance in shutdown or when EN is low. |
| 9 | R1IN | input | RS-232 receiver 1 input, tolerates ±30V and protected to ±15kV ESD. |
| 10 | GND | power_in | Ground. |
| 11 | VCC | power_in | +4.5V to +5.5V supply voltage input; bypass to ground with at least 0.1µF. |
| 12 | C1+ | passive | Positive terminal of charge pump capacitor C1 (0.1µF). |
| 13 | V+ | power_out | Charge pump output regulated to +6.5V; pulled to VCC in shutdown. |
| 14 | C1- | passive | Negative terminal of charge pump capacitor C1 (0.1µF). |
| 15 | C2+ | passive | Positive terminal of charge pump capacitor C2 (0.1µF). |
| 16 | C2- | passive | Negative terminal of charge pump capacitor C2 (0.1µF). |
| 17 | V- | power_out | Charge pump output regulated to -6.5V; pulled to ground in shutdown. |
| 18 | RIN5 | input | RS-232 receiver 5 input, stays active in shutdown, tolerates ±30V. |
| 19 | ROUT5 | tri_state | Receiver 5 TTL/CMOS output, remains active in shutdown when EN is high. |
| 20 | TIN3 | input | Driver 3 TTL/CMOS input, logic low below 0.8V and high above 2.4V. |
| 21 | TIN4 | input | Driver 4 TTL/CMOS input, logic low below 0.8V and high above 2.4V. |
| 22 | ROUT4 | tri_state | Receiver 4 TTL/CMOS output, remains active in shutdown when EN is high. |
| 23 | RIN4 | input | RS-232 receiver 4 input, stays active in shutdown, tolerates ±30V. |
| 24 | EN | input | Receiver enable, active high; low puts receiver outputs in high-impedance, no effect on drivers or charge pumps. |
| 25 | SHDN | input | Active-low shutdown; low turns off charge pumps and transmitters, reducing supply current to about 1µA. |
| 26 | ROUT3 | tri_state | Receiver 3 TTL/CMOS output, high-impedance in shutdown or when EN is low. |
| 27 | RIN3 | input | RS-232 receiver 3 input, tolerates ±30V and protected to ±15kV ESD. |
| 28 | TOUT4 | output | RS-232 driver 4 output, protected to ±15kV ESD. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Union Semiconductor |
| Package | SSOP-28 |
| Category | Interface |
| Pins | 28 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC Supply Voltage | VCC | -0.3 | 6 | V | 3 | ||
| Voltage on V+ | V+ | 9 | V | 3 | |||
| Voltage on V- | V- | -9 | 0.3 | V | 3 | ||
| Voltage on RIN_ | -30 | 30 | V | 3 | |||
| Continuous Power Dissipation SSOP28 | PD | 762 | mW | TA=70°C | 3 | ||
| Operating Temperature Range | TA | -40 | 85 | °C | 3 | ||
| Storage Temperature Range | TSTG | -65 | 165 | °C | 3 | ||
| Maximum Lead Temperature for Soldering | TL | 300 | °C | 10 seconds | 3 | ||
| Voltage on ROUT_ | -0.3 | V | Max is (VCC+0.3) | 3 | |||
| Voltage on TIN_ | -0.3 | V | Max is (VCC+0.3) | 3 | |||
| Supply Voltage Input VCC (operating) | VCC | 4.5 | 5.5 | V | 6 | ||
| Output Voltage Swing | 5 | 6 | V | All transmitter outputs loaded with 3kΩ to ground | 4 | ||
| VCC Power Supply Current | ICC | 0.6 | 1 | mA | No load | 4 | |
| Shutdown Supply Current (UM213) | 0.1 | 50 | μA | UM213 | 4 | ||
| Input Logic Threshold Low | 0.8 | V | TIN, EN, SHDN | 4 | |||
| Input Logic Threshold High | 2.4 | V | TIN, EN, SHDN | 4 | |||
| RS-232 Input Voltage Operating Range | -30 | 30 | V | 4 | |||
| Receiver Input Threshold Low (Active Mode) | 0.8 | 1.2 | V | VCC=+5V, TA=25°C, Active Mode | 4 | ||
| Receiver Input Threshold Low (Shut down Mode) | 0.6 | 1.5 | V | VCC=+5V, TA=25°C, Shut down Mode | 4 | ||
| Receiver Input Threshold High (Active Mode) | 1.7 | 2.4 | V | VCC=+5V, TA=25°C, Active Mode | 4 | ||
| Receiver Input Threshold High (Shut down Mode) | 1.5 | 2.4 | V | VCC=+5V, TA=25°C, Shut down Mode | 4 | ||
| Input Hysteresis | 0.2 | 0.5 | 1 | V | VCC=+5V, no hysteresis in shutdown | 4 | |
| Input Resistance | 3 | 5 | 7 | kΩ | VCC=+5V, TA=25°C | 4 | |
| TTL/CMOS Output Voltage Low | 0.4 | V | IOUT=1.6mA | 4 | |||
| TTL/CMOS Output Voltage High | 3.5 | V | IOUT=1.0mA | 4 | |||
| TTL/CMOS Output Leakage Current | -10 | 0.05 | 10 | μA | EN=VCC, EN=0V, 0≤ROUT≤VCC | 4 | |
| Output Enable Time (UM211/213) | 600 | ns | UM211/213 | 4 | |||
| Output Disable Time (UM211/213) | 200 | ns | UM211/213 | 4 | |||
| Receiver Propagation Delay (UM213) | 4 | 40 | μs | SHDN=0V, UM213 | 4 | ||
| Receiver Propagation Delay (UM213) | 0.5 | 10 | μs | SHDN=VCC, UM213 | 4 | ||
| Transmitter Output Resistance | 300 | Ω | VCC=V+=V-=0V, VOUT=±2V | 4 | |||
| Transition Region Slew Rate | 3 | 5.5 | 30 | V/μs | CL=50pF to 2500pF, RL=3kΩ to 7kΩ, VCC=+5V, TA=25°C, measured from +3V to -3V or -3V to +3V | 4 | |
| RS-232 Output Short Circuit Current | 10 | 30 | mA | 4 | |||
| Maximum Data Rate | 120 | 250 | kbps | RL=3kΩ to 7kΩ, CL=50pF to 1000pF, one transmitter | 4 |
CAD (KiCad official)
- Symbol:
UM213EEASR - Footprint:
Package_SO:SSOP-28_5.3x10.2mm_P0.65mm - 3D model: SSOP-28 (KiCad packages3D, STEP)
- 3D model files:
um213eeasr-etched.step/um213eeasr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);um213eeasr.step/um213eeasr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Union Semiconductor datasheet (27 pp, sha256
95e79390224c6dfd, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).