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ULN2004N

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HGSEMI Darlington Transistor Arrays, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ULN2004N

HGSEMI · Darlington Transistor Arrays · DIP-16

ULN2004N from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1B input Darlington channel 1 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
2 2B input Darlington channel 2 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
3 3B input Darlington channel 3 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
4 4B input Darlington channel 4 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
5 5B input Darlington channel 5 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
6 6B input Darlington channel 6 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
7 7B input Darlington channel 7 base input with 10.5-kΩ series resistor, for CMOS drive from 6 to 15 V supplies.
8 GND power_in Ground (emitter/substrate terminal E) common to all seven Darlington pairs.
9 COM passive Common cathode of the output clamp diodes, connected to the load supply for inductive load switching.
10 7C output Darlington channel 7 open-collector output, rated 500 mA and 50 V.
11 6C output Darlington channel 6 open-collector output, rated 500 mA and 50 V.
12 5C output Darlington channel 5 open-collector output, rated 500 mA and 50 V.
13 4C output Darlington channel 4 open-collector output, rated 500 mA and 50 V.
14 3C output Darlington channel 3 open-collector output, rated 500 mA and 50 V.
15 2C output Darlington channel 2 open-collector output, rated 500 mA and 50 V.
16 1C output Darlington channel 1 open-collector output, rated 500 mA and 50 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-16
Category Transistors/Thyristors
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-emitter saturation voltage VCE(sat) 0.9 1.1 V II=250µA, IC=100mA 5
Collector-emitter saturation voltage VCE(sat) 1 1.3 V II=350µA, IC=200mA 5
Collector-emitter saturation voltage VCE(sat) 1.2 1.6 V II=500µA, IC=350mA 5
Collector cutoff current ICEX 50 µA VCE=50V, II=0 5
Collector cutoff current ICEX 100 µA VCE=50V, TA=70°C, II=0 5
Collector cutoff current ICEX 500 µA VI = 1 V 5
Off-state input current II(off) 50 65 µA VCE=50V, IC=500µA, TA=70°C 5
Clamp forward voltage VF 1.7 2 V IF = 350 mA 5
Clamp reverse current IR 50 µA VR = 50 V 5
Clamp reverse current IR 100 µA VR = 50 V, TA = 70°C 5
Input capacitance Ci 15 25 pF VI = 0, f = 1 MHz 5
Input current II 0.93 1.35 mA VI = 3.85 V 5
Input current II 0.35 0.5 mA VI = 5 V 5
Input current II 1 1.45 mA VI = 12 V 5
Propagation delay time, low-to-high-level output tPLH 0.25 1 µs See Figure 9 5
Propagation delay time, high-to-low-level output tPHL 0.25 1 µs See Figure 9 5
Collector-emitter voltage 50 V 4
Input voltage VI 30 V see Note 1 (referenced to emitter/substrate E) 4
Peak collector current 500 mA see Figures 14 and 15 4
Output clamp current IOK 500 mA 4
Total emitter-terminal current -2.5 A 4
Operating free-air temperature range TA -20 85 °C 4
Storage temperature range Tstg -65 150 °C 4
Lead temperature (soldering) 260 °C 10 seconds 4
Continuous total power dissipation (DIP) PD 1150 mW DIP, TA = 25°C 4
Derating factor above TA=25°C (DIP) 9.2 mW/°C DIP, above TA = 25°C 4
Continuous power rating (DIP) 598 mW DIP, TA = 85°C 4
Internal series base resistor R 10.5 kΩ ULN2004 input series base resistor (from description text, not a table) 2

CAD (KiCad official)

  • Symbol: ULN2004N
  • Footprint: Package_DIP:DIP-16_W7.62mm
  • 3D model: DIP-16 (KiCad packages3D, STEP)
  • 3D model files: uln2004n-etched.step / uln2004n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); uln2004n.step / uln2004n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 a3310c4af7adb209, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF