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Contents

README

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UF630G-TN3-R

UTC(Unisonic Tech) · MOSFETs · TO-252

UF630G-TN3-R from UTC(Unisonic Tech), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel with VGS rated ±20 V max and RDS(ON) < 0.4Ω at VGS = 10V, ID = 5A.
2 D passive Drain; connects to the load with VDSS rated 200 V and continuous drain current of 9 A.
3 S passive Source; current return terminal of the N-channel MOSFET, with continuous diode forward current of 9 A.

Key specifications

Parameter Value
Manufacturer UTC(Unisonic Tech)
Package TO-252
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 200 V VGS = 0V, ID = 250μA 4
On-State Drain Current ID(ON) 9 A VDS > ID(ON) x RDS(ON)MAX, VGS = 10V 4
Drain-Source Leakage Current IDSS 10 μA VDS = Rated BVDSS, VGS = 0V 4
Gate-Source Leakage Current Forward IGSS 100 nA VGS = 20V, VDS = 0V 4
Gate-Source Leakage Current Reverse IGSS -100 nA VGS = -20V, VDS = 0V 4
Gate Threshold Voltage VGS(TH) 2 4 V VGS = VDS, ID = 250μA 4
Static Drain-Source On-State Resistance RDS(ON) 0.25 0.4 Ω VGS = 10V, ID = 5A 4
Total Gate Charge QG 19 30 nC VGS = 10V, ID = 9A, VDS = 0.8 x Rated BVDSS, IG(REF) = 1.5mA 4
Drain-Source Diode Forward Voltage VSD 2 V VGS =0V, IS = 9.0A 4
Maximum Continuous Drain-Source Diode Forward Current IS 9 A 4
Maximum Pulsed Drain-Source Diode Forward Current ISM 36 A 4
Drain-Source Voltage VDSS 200 V TC = 25°C 3
Drain-Gate Voltage VDGR 200 V RGS = 20kΩ, TJ =25°C ~125°C 3
Gate-Source Voltage VGSS -20 20 V TC = 25°C 3
Continuous Drain Current ID 9 A TC = 25°C 3
Pulsed Drain Current IDM 36 A Note 2 3
Single Pulse Avalanche Energy EAS 150 mJ L = 4mH, IAS = 8.3A, VDD = 20V, RG = 25 Ω, Starting TJ = 25°C 3
Power Dissipation (TO-251/TO-252) PD 46 W TC = 25°C 3
Junction Temperature TJ 150 °C 3
Storage Temperature TSTG -55 150 °C 3
Junction to Ambient Thermal Resistance (TO-251/TO-252) θJA 100.3 °C/W 3
Junction to Case Thermal Resistance (TO-251/TO-252) θJC 2.7 °C/W 3
Input Capacitance CISS 600 pF VDS = 25V, VGS = 0V, f = 1.0MHz 4
Output Capacitance COSS 250 pF VDS = 25V, VGS = 0V, f = 1.0MHz 4
Reverse Transfer Capacitance CRSS 80 pF VDS = 25V, VGS = 0V, f = 1.0MHz 4
Turn-On Delay Time tD(ON) 30 ns VDD = 90V, ID≈9A, RGS = 9.1Ω, VGS = 10V, RL = 9.6Ω 4
Turn-On Rise Time tR 50 ns VDD = 90V, ID≈9A, RGS = 9.1Ω, VGS = 10V, RL = 9.6Ω 4
Turn-Off Delay Time tD(OFF) 50 ns VDD = 90V, ID≈9A, RGS = 9.1Ω, VGS = 10V, RL = 9.6Ω 4
Turn-Off Fall Time tF 40 ns VDD = 90V, ID≈9A, RGS = 9.1Ω, VGS = 10V, RL = 9.6Ω 4
Gate-Source Charge QGS 10 nC VGS = 10V, ID = 9A, VDS = 0.8 x Rated BVDSS, IG(REF) = 1.5mA 4
Gate-Drain Charge QGD 9 nC VGS = 10V, ID = 9A, VDS = 0.8 x Rated BVDSS, IG(REF) = 1.5mA 4
Reverse Recovery Time trr 450 ns IS = 9.0A, dIS/dt = 100A/μs 4
Reverse Recovery Charge QRR 3 μC IS = 9.0A, dIS/dt = 100A/μs 4

CAD (KiCad official)

  • Symbol: UF630G-TN3-R
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: uf630g-tn3-r-etched.step / uf630g-tn3-r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); uf630g-tn3-r.step / uf630g-tn3-r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UTC(Unisonic Tech) datasheet (8 pp, sha256 dbcdfdb55d19c861, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF