component
UCC28881D
Public Made by Adomby adom
Texas Instruments AC-DC Controllers And Regulators, SOIC-7. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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UCC28881D
Texas Instruments · AC-DC Controllers And Regulators · SOIC-7
UCC28881D from Texas Instruments, in a SOIC-7. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin; all device voltages are specified with respect to GND. |
| 2 | GND | power_in | Ground reference pin; all device voltages are specified with respect to GND. |
| 3 | FB | input | Feedback terminal; absolute maximum rating is -0.3 V to 6 V. |
| 4 | VDD | power_out | Supply pin supplied by the internal LDO; absolute maximum rating is -0.3 V to 6 V, with 400 µA maximum current when supplied from a high-impedance source. |
| 5 | HVIN | power_in | High-voltage supply pin for the integrated current source; absolute maximum rating is -0.3 V to 700 V. |
| 6 | NC | unconnected | Not internally connected. |
| 8 | DRAIN | power_in | Drain pin of the integrated 14-Ω, 700-V power MOSFET; internally clamped with a 700 V rating and -700 mA maximum negative drain current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-7 |
| Category | Power Management (PMIC) |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| HVIN voltage | HVIN | -0.3 | 700 | V | TA = 25°C | 4 | |
| DRAIN voltage | DRAIN | 700 | V | TA = 25°C | 4 | ||
| Positive drain current single pulse | IDRAIN | 770 | mA | single pulse, pulse max duration 25 μs | 4 | ||
| Negative drain current | IDRAIN | -700 | mA | 4 | |||
| FB voltage | FB | -0.3 | 6 | V | 4 | ||
| VDD voltage | VDD | -0.3 | 6 | V | VDD is supplied from low impedance source | 4 | |
| VDD supply current | IVDD | 400 | µA | VDD is supplied from high impedance source | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Lead temperature | 260 | °C | 1.6 mm (1/16 inch) from case 10 seconds | 4 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 4 | ||
| Voltage on FB pin | VFB | -0.2 | 5 | V | 5 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 5 | ||
| Internally regulated low voltage supply | VVDD | 4.5 | 5 | 5.5 | V | supplied from HVIN pin | 6 |
| Internal supply current, no load | INL | 58 | 100 | µA | FB = 1.25 V (> VFB_TH) | 6 | |
| Internal supply current, full load | IFL | 86 | 120 | µA | FB = 0.75 V (> VFB_TH) | 6 | |
| Charging VDD cap current | ICH0 | -3.8 | -1.6 | -0.4 | mA | VVDD = 0 V | 6 |
| Charging VDD cap current | ICH1 | -3.4 | -1.3 | -0.25 | mA | VVDD = 4.4V, VFB = 1.25 V | 6 |
| FB pin reference threshold | VFB_TH | 0.96 | 1.03 | 1.105 | V | 6 | |
| VDD turn-on threshold | VVDD(on) | 3.55 | 3.92 | 4.28 | V | VDD low-to-high | 6 |
| VDD turn-off threshold | VVDD(off) | 3.28 | 3.62 | 3.89 | V | VDD high-to-low | 6 |
| VDD UVLO Hysteresis | ΔVVDD(uvlo) | 0.27 | 0.345 | 0.39 | V | VDD high-to-low | 6 |
| Maximum Duty Cycle | DMAX | 45 | 55 | % | FB = 0.75 V | 6 | |
| Current Limit static at TA = -40°C | ILIMIT | 630 | mA | Static, TA = -40°C | 6 | ||
| Current Limit static at TA = 25°C | ILIMIT | 330 | 440 | 570 | mA | Static, TA = 25°C | 6 |
| Current Limit static at TA = 125°C | ILIMIT | 315 | mA | Static, TA = 125°C | 6 | ||
| Thermal shutdown threshold | TJ(stop) | 138.5 | 150 | °C | Internal junction temperature | 6 | |
| Thermal shutdown hysteresis | TJ(hyst) | 37 | 45 | °C | Internal junction temperature | 6 | |
| Power MOSFET On-Resistance at 25°C | RDS(on) | 14 | 18 | Ω | ID = 60 mA, TJ = 25°C | 6 | |
| Power MOSFET On-Resistance at 125°C | RDS(on) | 24 | 30 | Ω | ID = 60 mA, TJ = 125°C | 6 | |
| Power MOSFET off state leakage current at 25°C | DRAIN_ILEAKAGE | 5 | µA | VDRAIN = 700V, TJ = 25°C | 6 | ||
| Power MOSFET off state leakage current at 125°C | DRAIN_ILEAKAGE | 20 | µA | VDRAIN = 400 V, TJ = 125°C | 6 | ||
| HVIN off state current at 25°C | HVIN_IOFF | 4 | 7.5 | 36 | µA | VHVIN = 700 V, TJ = 25°C, VVDD = 5.8 V | 6 |
| HVIN off state current at 125°C | HVIN_IOFF | 20 | µA | VHVIN = 400 V, TJ = 125°C, VVDD = 5.8 V | 6 | ||
| VDD clamp voltage | VVDD(clamp) | 6 | 6.7 | 7.5 | V | IVDD = 250 µA | 6 |
| Maximum switching frequency | fSW(max) | 52 | 62 | 75 | kHz | 6 | |
| Maximum switch on time | tON_MAX | 6.5 | 8.3 | 9.7 | µs | current limiter not triggered, FB = 0.75 V | 6 |
| Minimum switch off time | tOFF_MIN | 6.5 | 8.3 | 9.7 | µs | follows every tON time, FB = 0.75 V | 6 |
| Minimum on time | tMIN | 0.17 | 0.27 | 0.3 | µs | 6 | |
| Max off time (OL condition) | tOFF(ovl) | 130 | 200 | 270 | µs | OL condition, tOFF(ovl) = tSW, tON(max) | 6 |
| Minimum voltage to start-up | VHVIN(min) | 30 | V | 6 | |||
| Power MOSFET breakdown voltage | BV | 700 | V | TJ = 25°C | 6 | ||
| Inductor current run away protection time threshold | tON_TO | 450 | ns | 6 | |||
| Junction-to-ambient thermal resistance | RθJA | 134.4 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 42.6 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 85 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 6.4 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 76 | °C/W | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • Similarly, the copper area of the FB pin should be minimized to reduce coupling to feedback path. Loop CL | 26 |
CAD (KiCad official)
- Symbol:
UCC28881D - Footprint:
Package_SO:SOIC-8-N7_3.9x4.9mm_P1.27mm - 3D model: SOIC-7 (KiCad packages3D, STEP)
- 3D model files:
ucc28881d-etched.step/ucc28881d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ucc28881d.step/ucc28881d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (33 pp, sha256
1fba7780301ae99d, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# UCC28881D
**Texas Instruments** · AC-DC Controllers And Regulators · SOIC-7
UCC28881D from Texas Instruments, in a SOIC-7. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin; all device voltages are specified with respect to GND. |
| 2 | GND | power_in | Ground reference pin; all device voltages are specified with respect to GND. |
| 3 | FB | input | Feedback terminal; absolute maximum rating is -0.3 V to 6 V. |
| 4 | VDD | power_out | Supply pin supplied by the internal LDO; absolute maximum rating is -0.3 V to 6 V, with 400 µA maximum current when supplied from a high-impedance source. |
| 5 | HVIN | power_in | High-voltage supply pin for the integrated current source; absolute maximum rating is -0.3 V to 700 V. |
| 6 | NC | unconnected | Not internally connected. |
| 8 | DRAIN | power_in | Drain pin of the integrated 14-Ω, 700-V power MOSFET; internally clamped with a 700 V rating and -700 mA maximum negative drain current. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-7 |
| Category | Power Management (PMIC) |
| Pins | 7 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| HVIN voltage | HVIN | -0.3 | | 700 | V | TA = 25°C | 4 |
| DRAIN voltage | DRAIN | | | 700 | V | TA = 25°C | 4 |
| Positive drain current single pulse | IDRAIN | | | 770 | mA | single pulse, pulse max duration 25 μs | 4 |
| Negative drain current | IDRAIN | -700 | | | mA | | 4 |
| FB voltage | FB | -0.3 | | 6 | V | | 4 |
| VDD voltage | VDD | -0.3 | | 6 | V | VDD is supplied from low impedance source | 4 |
| VDD supply current | IVDD | | | 400 | µA | VDD is supplied from high impedance source | 4 |
| Junction temperature | TJ | | | 150 | °C | | 4 |
| Lead temperature | | | | 260 | °C | 1.6 mm (1/16 inch) from case 10 seconds | 4 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 4 |
| Voltage on FB pin | VFB | -0.2 | | 5 | V | | 5 |
| Operating junction temperature | TJ | -40 | | 125 | °C | | 5 |
| Internally regulated low voltage supply | VVDD | 4.5 | 5 | 5.5 | V | supplied from HVIN pin | 6 |
| Internal supply current, no load | INL | | 58 | 100 | µA | FB = 1.25 V (> VFB_TH) | 6 |
| Internal supply current, full load | IFL | | 86 | 120 | µA | FB = 0.75 V (> VFB_TH) | 6 |
| Charging VDD cap current | ICH0 | -3.8 | -1.6 | -0.4 | mA | VVDD = 0 V | 6 |
| Charging VDD cap current | ICH1 | -3.4 | -1.3 | -0.25 | mA | VVDD = 4.4V, VFB = 1.25 V | 6 |
| FB pin reference threshold | VFB_TH | 0.96 | 1.03 | 1.105 | V | | 6 |
| VDD turn-on threshold | VVDD(on) | 3.55 | 3.92 | 4.28 | V | VDD low-to-high | 6 |
| VDD turn-off threshold | VVDD(off) | 3.28 | 3.62 | 3.89 | V | VDD high-to-low | 6 |
| VDD UVLO Hysteresis | ΔVVDD(uvlo) | 0.27 | 0.345 | 0.39 | V | VDD high-to-low | 6 |
| Maximum Duty Cycle | DMAX | 45 | | 55 | % | FB = 0.75 V | 6 |
| Current Limit static at TA = -40°C | ILIMIT | | | 630 | mA | Static, TA = -40°C | 6 |
| Current Limit static at TA = 25°C | ILIMIT | 330 | 440 | 570 | mA | Static, TA = 25°C | 6 |
| Current Limit static at TA = 125°C | ILIMIT | 315 | | | mA | Static, TA = 125°C | 6 |
| Thermal shutdown threshold | TJ(stop) | 138.5 | | 150 | °C | Internal junction temperature | 6 |
| Thermal shutdown hysteresis | TJ(hyst) | 37 | | 45 | °C | Internal junction temperature | 6 |
| Power MOSFET On-Resistance at 25°C | RDS(on) | | 14 | 18 | Ω | ID = 60 mA, TJ = 25°C | 6 |
| Power MOSFET On-Resistance at 125°C | RDS(on) | | 24 | 30 | Ω | ID = 60 mA, TJ = 125°C | 6 |
| Power MOSFET off state leakage current at 25°C | DRAIN_ILEAKAGE | | 5 | | µA | VDRAIN = 700V, TJ = 25°C | 6 |
| Power MOSFET off state leakage current at 125°C | DRAIN_ILEAKAGE | | 20 | | µA | VDRAIN = 400 V, TJ = 125°C | 6 |
| HVIN off state current at 25°C | HVIN_IOFF | 4 | 7.5 | 36 | µA | VHVIN = 700 V, TJ = 25°C, VVDD = 5.8 V | 6 |
| HVIN off state current at 125°C | HVIN_IOFF | | 20 | | µA | VHVIN = 400 V, TJ = 125°C, VVDD = 5.8 V | 6 |
| VDD clamp voltage | VVDD(clamp) | 6 | 6.7 | 7.5 | V | IVDD = 250 µA | 6 |
| Maximum switching frequency | fSW(max) | 52 | 62 | 75 | kHz | | 6 |
| Maximum switch on time | tON_MAX | 6.5 | 8.3 | 9.7 | µs | current limiter not triggered, FB = 0.75 V | 6 |
| Minimum switch off time | tOFF_MIN | 6.5 | 8.3 | 9.7 | µs | follows every tON time, FB = 0.75 V | 6 |
| Minimum on time | tMIN | 0.17 | 0.27 | 0.3 | µs | | 6 |
| Max off time (OL condition) | tOFF(ovl) | 130 | 200 | 270 | µs | OL condition, tOFF(ovl) = tSW, tON(max) | 6 |
| Minimum voltage to start-up | VHVIN(min) | | 30 | | V | | 6 |
| Power MOSFET breakdown voltage | BV | | 700 | | V | TJ = 25°C | 6 |
| Inductor current run away protection time threshold | tON_TO | | 450 | | ns | | 6 |
| Junction-to-ambient thermal resistance | RθJA | | 134.4 | | °C/W | | 5 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 42.6 | | °C/W | | 5 |
| Junction-to-board thermal resistance | RθJB | | 85 | | °C/W | | 5 |
| Junction-to-top characterization parameter | ψJT | | 6.4 | | °C/W | | 5 |
| Junction-to-board characterization parameter | ψJB | | 76 | | °C/W | | 5 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | • Similarly, the copper area of the FB pin should be minimized to reduce coupling to feedback path. Loop CL | 26 |
## CAD (KiCad official)
- Symbol: `UCC28881D`
- Footprint: `Package_SO:SOIC-8-N7_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-7 (KiCad packages3D, STEP)
- 3D model files: `ucc28881d-etched.step` / `ucc28881d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ucc28881d.step` / `ucc28881d.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ucc28881.pdf) (33 pp, sha256 `1fba7780301ae99d`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ucc28881d-datasheet.pdf)