component
UCC21738QDWRQ1
Public Made by Adomby adom
Texas Instruments Isolators - Gate Drivers, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUCC21738QDWRQ1
Texas Instruments · Isolators - Gate Drivers · SOIC-16
UCC21738QDWRQ1 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ASC | input | Active high input that enables the active short circuit function to force the output high during system failure events; tie to COM if unused. |
| 2 | OC | input | Overcurrent detection input for SenseFET, DESAT, and shunt resistor sensing; tie to COM if unused. |
| 3 | COM | power_in | Common ground reference that connects to the emitter pin for IGBT or the source pin for SiC MOSFET. |
| 4 | OUTH | output | Gate driver pull-up output. |
| 5 | VDD | power_in | Positive gate drive supply rail, to be bypassed with a >10-µF capacitor to COM placed close to the pin to support the specified source peak current. |
| 6 | OUTL | output | Gate driver pull-down output. |
| 7 | CLMPE | output | External active Miller clamp control that connects to the gate of the external Miller clamp MOSFET; leave floating if unused. |
| 8 | VEE | power_in | Negative gate drive supply rail, to be bypassed with a >10-µF capacitor to COM placed close to the pin to support the specified sink peak current. |
| 9 | GND | power_in | Input power supply and logic ground reference. |
| 10 | IN+ | input | Noninverting gate driver control input; tie to VCC if unused. |
| 11 | IN- | input | Inverting gate driver control input; tie to GND if unused. |
| 12 | RDY | output | Open-drain power-good output for VCC-GND and VDD-COM that can be paralleled with other RDY signals. |
| 13 | FLT | output | Open-drain active-low fault alarm output asserted upon overcurrent or short circuit that can be paralleled with other faults. |
| 14 | RST/EN | input | Enables or shuts down the output side (regular turn-off when set low) and resets an OC condition on FLT when held low for more than 1000 ns; tie to IN+ for automatic reset. |
| 15 | VCC | power_in | Input power supply from 3 V to 5.5 V, to be bypassed with a >1-µF capacitor to GND placed close to the pin. |
| 16 | APWM | output | Isolated PWM output that monitors the ASC pin status; leave floating if unused. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16 |
| Category | Power Management (PMIC) |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC supply voltage (VCC - GND) | VCC | -0.3 | 6 | V | VCC - GND | 4 | |
| VDD supply voltage (VDD - COM) | VDD | -0.3 | 36 | V | VDD - COM | 4 | |
| VEE supply voltage (VEE - COM) | VEE | -17.5 | 0.3 | V | VEE - COM | 4 | |
| VMAX voltage (VDD - VEE) | VMAX | -0.3 | 36 | V | VDD - VEE | 4 | |
| ASC input voltage | ASC | -0.3 | 6 | V | Reference to COM | 4 | |
| OC input voltage | OC | -0.3 | 6 | V | Reference to COM | 4 | |
| CLMPE voltage | CLMPE | -0.3 | 5 | V | Reference to VEE | 4 | |
| Junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| VCC supply voltage (VCC - GND) | VCC | 3 | 5.5 | V | VCC-GND | 4 | |
| VDD supply voltage (VDD - COM) | VDD | 13 | 33 | V | VDD-COM | 4 | |
| VEE supply voltage (VEE - COM) | VEE | -16 | 0 | V | VEE-COM | 4 | |
| VMAX voltage (VDD - VEE) | VMAX | 33 | V | VDD-VEE | 4 | ||
| ASC input voltage | ASC | 0 | 5 | V | Reference to COM | 4 | |
| Minimum RST/EN pulse width to reset fault | tRST/EN | 1000 | ns | Minimum pulse width that reset the fault | 4 | ||
| Ambient temperature | TA | -40 | 125 | °C | 4 | ||
| Junction temperature | TJ | -40 | 150 | °C | 5 | ||
| VCC UVLO on threshold | VVCC_ON | 2.55 | 2.7 | 2.85 | V | VCC - GND | 7 |
| VCC UVLO off threshold | VVCC_OFF | 2.35 | 2.5 | 2.65 | V | VCC - GND | 7 |
| VDD UVLO on threshold | VVDD_ON | 10.5 | 11.4 | 12.8 | V | VDD - COM | 7 |
| VDD UVLO off threshold | VVDD_OFF | 9.9 | 10.6 | 11.8 | V | VDD - COM | 7 |
| VCC quiescent current | IVCCQ | 2.5 | 3 | 4 | mA | OUT(H) = High, fS = 0Hz | 7 |
| VCC quiescent current | IVCCQ | 1.45 | 2 | 2.75 | mA | OUT(L) = Low, fS = 0Hz | 7 |
| VDD quiescent current | IVDDQ | 2.4 | 3.1 | 5.3 | mA | OUT(H) = High, fS = 0Hz | 7 |
| VDD quiescent current | IVDDQ | 2.2 | 2.9 | 4.7 | mA | OUT(L) = Low, fS = 0Hz | 7 |
| IN+, IN- and RST/EN deglitch filter time (ON and OFF) | TINFIL | 28 | 40 | 60 | ns | fS = 50kHz | 7 |
| Deglitch filter time to reset FLT | TRSTFIL | 500 | 650 | 800 | ns | 7 | |
| Output active pull down on OUTL | VOUTPD | 1.5 | 2 | 2.5 | V | IOUTL(typ) = 0.1×IOUTL(typ), VDD=OPEN, VEE=COM | 7 |
| Miller clamp threshold voltage | VCLMPTH | 1.5 | 2 | 2.5 | V | Reference to VEE | 8 |
| Miller clamp output high voltage | VCLMPE | 4.8 | 5 | 5.3 | V | 8 | |
| Peak clamp sink current | ICLMPEL | 0.12 | 0.25 | 0.37 | A | 8 | |
| OC detection threshold | VOCTH | 0.63 | 0.7 | 0.77 | V | 8 | |
| OC fault deglitch filter | tOCFIL | 95 | 120 | 180 | ns | 8 | |
| OC propagation delay to OUTL 90% | tOCOFF | 150 | 270 | 400 | ns | 8 | |
| OC to FLT low delay | tOCFLT | 300 | 530 | 750 | ns | 8 | |
| Soft turn-off current on fault condition | ISTO | 500 | 900 | 1200 | mA | VDD-VEE = 20 V, OUTL = 8 V | 8 |
| ASC input low threshold | VASCL | 1.35 | 1.5 | 1.71 | V | 8 | |
| ASC input high threshold | VASCH | 2.7 | 2.9 | 3.17 | V | 8 | |
| ASC to output rising edge delay | tASC_r | 390 | 660 | 1120 | ns | 8 | |
| ASC to output falling edge delay | tASC_f | 152 | 300 | 477 | ns | 8 | |
| APWM output frequency | fAPWM | 360 | 400 | 440 | kHz | VASC=2.5V | 8 |
| APWM duty cycle | DAPWM | 9 | 11.5 | 13.5 | % | VASC=0.6V | 8 |
| APWM duty cycle | DAPWM | 48.5 | 50 | 51.5 | % | VASC=2.5V | 8 |
| APWM duty cycle | DAPWM | 87.5 | 90 | 92.5 | % | VASC=4.5V | 8 |
| Common-mode transient immunity | CMTI | 150 | V/ns | VCM = 1500 V | 8 | ||
| Propagation delay time low-to-high | tPDLH | 60 | 90 | 130 | ns | VCC = 5.0 V, CL = 100pF | 9 |
| Propagation delay time high-to-low | tPDHL | 60 | 90 | 130 | ns | VCC = 5.0 V, CL = 100pF | 9 |
| Junction-to-ambient thermal resistance | RθJA | 68.3 | °C/W | DW (SOIC) 16 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 27.5 | °C/W | DW (SOIC) 16 pins | 5 | ||
| Junction-to-board thermal resistance | RθJB | 32.9 | °C/W | DW (SOIC) 16 pins | 5 | ||
| Junction-to-top characterization parameter | ΨJT | 14.1 | °C/W | DW (SOIC) 16 pins | 5 | ||
| Junction-to-board characterization parameter | ΨJB | 32.3 | °C/W | DW (SOIC) 16 pins | 5 |
CAD (KiCad official)
- Symbol:
UCC21738QDWRQ1 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
ucc21738qdwrq1-etched.step/ucc21738qdwrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ucc21738qdwrq1.step/ucc21738qdwrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (53 pp, sha256
86319bfd941feb0e, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).