# TZ3261C

**TST** · Crystals · SMD2016-4P

TZ3261C from TST, in a SMD2016-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN/OUT | passive | Crystal terminal connected to the resonator, used with 8 pF load capacitance at 24.000000 MHz fundamental mode. |
| 2 | GND | power_in | Ground pin connected to the metal cover (pins #2 and #4 are connected with the metal cover). |
| 3 | IN/OUT | passive | Second crystal terminal connected to the resonator, interchangeable with pin 1, drive level 50uW typical and 200uW max. |
| 4 | GND | power_in | Ground pin connected to the metal cover (pins #2 and #4 are connected with the metal cover). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TST |
| Package | SMD2016-4P |
| Category | Resonators/Oscillators |
| Pins | 4 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Frequency Stability over Operating Temperature Range |  | -50 |  | 50 | ppm | referred to the value at 25C | 3 |
| Frequency Make Tolerance | FL | -10 |  | 10 | ppm | @ 25C +/- 3C | 3 |
| Equivalent Series Resistance | ESR |  |  | 80 | Ω |  | 3 |
| Drive Level |  |  | 50 | 200 | uW | Nominal Drive Level | 3 |
| Shunt Capacitance | Co |  |  | 3 | pF |  | 3 |
| Aging |  | -2 |  | 2 | ppm/year |  | 3 |
| Insulation Resistance |  | 500 |  |  | MΩ | DC 100V | 3 |
| Operating Temperature Range |  | -40 |  | 125 | °C |  | 3 |
| Storage Temperature Range |  | -40 |  | 125 | °C |  | 3 |
| Nominal Frequency |  |  | 24 |  | MHz | Fundamental mode | 3 |
| Load Capacitance | CL |  | 8 |  | pF |  | 3 |

## CAD (KiCad official)

- Symbol: `TZ3261C`
- Footprint: `Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm`
- 3D model: SMD2016-4P (KiCad packages3D, STEP)
- 3D model files: `tz3261c-etched.step` / `tz3261c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tz3261c.step` / `tz3261c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TST datasheet](docs/tz3261c-datasheet.pdf) (8 pp, sha256 `dbecf6c456270fac`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tz3261c-datasheet.pdf)