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Contents

README

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TX6133

XDS · LED Drivers · ESOP-8

TX6133 from XDS, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin for the LED constant-current driver; the current-sense resistor R2 should connect to CS and GND with short, thick traces to limit parasitic resistance error.
2 VDD power_in Chip supply pin fed through resistor R1 from the input, with an internal VDD clamp of 5.8 V typical (I_VDD < 10 mA) and UVLO at 4.1 V rising with 0.4 V hysteresis; the clamp current must not exceed 10 mA.
3 NC unconnected Not internally connected; leave floating.
4 SW output Switching node connected to the internal power MOSFET drain, rated up to 100 V.
5 CS input Current-sense input referenced to GND, with a sense threshold VCS of 192 mV min, 200 mV typical and 208 mV max that sets the average LED current.
6 HL input High/low brightness select: a high level gives half-brightness (1/2 current), while floating or grounded gives full brightness; an internal pull-down of 80 kΩ (typ) is present, and the HL/CS absolute voltage range is -0.3 V to VDD ±0.3 V.
7 NC unconnected Not internally connected; leave floating.
8 NC unconnected Not internally connected; leave floating.
9 EP passive Exposed heat-sink pad internally connected to the SW pin (MOSFET drain) for thermal dissipation.

Key specifications

Parameter Value
Manufacturer XDS
Package ESOP-8
Category LED Drivers
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCS threshold VCS 192 200 208 mV 4
Supply voltage HVDD 6 V 3
HL/CS voltage V_MAX -0.3 V 3
Switch pin voltage V_SW 100 V 3
Maximum power dissipation P_ESOP8 0.8 W ESOP8 3
ESD withstand voltage V_ESD 2000 V 3
Operating temperature TA -20 85 ℃ 3
Storage temperature T_STG -40 120 ℃ 3
Soldering temperature T_SD 240 ℃ 焊接,10秒左右 3
VDD clamp voltage VDD 5.8 V I_VDD<10mA 4
Undervoltage lockout threshold voltage V_UVLO 4.1 V VDD上升 4
Undervoltage lockout hysteresis VDD_HYS 0.4 V 4
Operating current I_OP 1.8 mA F_OP=140KHz 4
Standby current I_INQ 500 uA 无负载,EN为低电平 4
Operating frequency Fs 140 KHz 4
HL pull-down resistance R_HL 80 Kohm 4
Over-temperature regulation threshold OTP_TH 140 ℃ 4

CAD (KiCad official)

  • Symbol: TX6133
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: tx6133-etched.step / tx6133-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tx6133.step / tx6133.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XDS datasheet (6 pp, sha256 4bdd4b1535d0bf91, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF