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Contents

README

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TX6126

XDS · LED Drivers · ESOP-8

TX6126 from XDS, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Device ground reference. Connect to the system ground plane close to the CS sense resistor return for accurate current sensing.
2 NC unconnected No connect. Leave floating (悬空).
3 DIM input Dimming control input. Pulling below 0.9V shuts down the LED output; above 3.1V forces 100% output current. Supports PWM dimming and linear dimming (linear range 1.1-3.1V). Must not be left floating; add >=10nF to GND for linear dimming.
4 SW output Switch node, internally connected to the drain of the integrated 90V power MOSFET. Connects to the inductor / freewheel diode of the buck power stage. Max VDS = 90V.
5 CS input Inductor peak current sense input. Internally paralleled with pin 6 (both CS pins are the same net). Threshold VCS_TH = 245/255/265 mV across the external sense resistor R2.
6 CS input Inductor peak current sense input (second CS pin, tied to pin 5 internally on the ESOP8 variant). Sense threshold 250 mV typical.
7 TOFF input Off-time programming pin. Fixed off-time is set by an external capacitor C1 via TOFF = 0.51 * 150kΩ * (C1 + 8pF) + TD (TD = 61 ns). With no external cap, the internal default TOFF is 650 ns.
8 VDD power_in Chip supply. Internally clamped by a 5.5V shunt zener (I_VDD < 10 mA). Supplied from VIN through dropping resistor R1 = (VIN - VDD) / I_VDD (typical I_VDD ≈ 2 mA). UVLO rising 2.6V, hysteresis 0.4V.
9 EP passive Exposed thermal pad on the ESOP8 package. Internally connected to the SW pin (MOSFET drain). Solder to a copper pour that follows the SW node for heat dissipation - do NOT tie to GND.

Key specifications

Parameter Value
Manufacturer XDS
Package ESOP-8
Category LED-drv
Pins 9

CAD (KiCad official)

  • Symbol: TX6126
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: tx6126-etched.step / tx6126-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tx6126.step / tx6126.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XDS datasheet (8 pp, sha256 0fb4682c062a3625, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF