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TUSB1105RTZR

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Texas Instruments USB Converters, WQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TUSB1105RTZR

Texas Instruments · USB Converters · WQFN-16-EP(3x3)

TUSB1105RTZR from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Output enable (active LOW, CMOS level with respect to VCC(I/O)); enables transceiver to transmit data on USB bus, push pull, CMOS.
2 RCV output Differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when SUSPND is HIGH, 4-mA output drive, stable during SE0 condition, push pull, CMOS.
3 VP output Single-ended D+ receiver output (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions, and connected device speed, driven HIGH when no supply voltage on VCC(5.0) and Vreg(3.3), 4-mA output drive, push pull, CMOS.
4 VM output Single-ended D- receiver output (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions, and connected device speed, driven HIGH when no supply voltage on VCC(5.0) and Vreg(3.3), 4-mA output drive, push pull, CMOS.
5 SUSPND input Suspend input (CMOS level with respect to VCC(I/O), active HIGH); HIGH level enables low-power state while USB bus is inactive and drives RCV output to LOW, push pull, CMOS.
6 MODE input Mode selection input (CMOS level with respect to VCC(I/O)); HIGH enables differential input mode (VPO, VMO), LOW enables single-ended input mode (VO, FSE0), push pull, CMOS.
7 VCC(I/O) power_in Supply voltage for digital I/O pins (1.65 V to 3.6 V); independent of VCC(5.0) and Vreg(3.3), must never exceed Vreg(3.3) voltage.
8 SPEED input Speed selection input (CMOS level with respect to VCC(I/O)); adjusts slew rate of D+ and D- differential outputs according to transmission speed: LOW = 1.5 Mbit/s (low-speed), HIGH = 12 Mbit/s (full-speed), push pull, CMOS.
9 D- bidirectional Negative USB data bus connection (analog, differential); for low-speed mode, connect to Vpu(3.3) via 1.5-kΩ resistor.
10 D+ bidirectional Positive USB data bus connection (analog, differential); for full-speed mode, connect to Vpu(3.3) via 1.5-kΩ resistor.
11 VPO/VO input Driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); used for differential input data interface (MODE = HIGH) and single-ended input data interface (MODE = LOW), push pull, CMOS.
12 VMO/FSE0 input Driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); used for differential input data interface (MODE = HIGH) and single-ended input data interface (MODE = LOW), push pull, CMOS.
13 Vreg(3.3) power_out Internal regulator option; regulated supply-voltage output (3 V to 3.6 V) during 5-V operation, requires at least 0.1 µF decoupling capacitor, or used as supply-voltage input for 3.3 V ± 10% operation in regulator bypass mode.
14 VCC(5.0) power_in Supply-voltage input (4 V to 5.5 V); can be connected directly to USB supply VBUS for internal regulator mode, or connected to Vreg(3.3) for regulator bypass mode.
15 Vpu(3.3) power_out Pullup supply voltage (3.3 V ± 10%); pin function controlled by SOFTCON input: LOW = floating (high impedance, zero pullup current), HIGH = 3.3 V internally connected to Vreg(3.3); connect external 1.5-kΩ resistor to D+ for full-speed or D- for low-speed.
16 SOFTCON input Software-controlled USB connection input (CMOS level with respect to VCC(I/O)); HIGH level applies 3.3 V to Vpu(3.3) for USB connect/disconnect signaling, push pull, CMOS.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16-EP(3x3)
Category Interface
Pins 17

CAD (KiCad official)

  • Symbol: TUSB1105RTZR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tusb1105rtzr-etched.step / tusb1105rtzr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tusb1105rtzr.step / tusb1105rtzr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 82d46206cda20726, retrieved 2026-10-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF