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TT0515THX

Shenzhen JingYang · ESD And Surge Protection (TVS/ESD) · SOT-563

TT0515THX from Shenzhen JingYang, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O_1 bidirectional Protected high-speed data line with a TVS clamp to GND; typical capacitance is 0.6pF (0.8pF maximum) between I/O and GND at 0V, 1MHz, and the working voltage is 3.3V.
2 GND power_in Common ground reference for the TVS clamps; all I/O pins clamp to this pin.
3 I/O_2 bidirectional Protected high-speed data line with a TVS clamp to GND; typical capacitance is 0.6pF (0.8pF maximum) between I/O and GND at 0V, 1MHz, and the working voltage is 3.3V.
4 I/O_3 bidirectional Protected high-speed data line with a TVS clamp to GND; typical capacitance is 0.6pF (0.8pF maximum) between I/O and GND at 0V, 1MHz, and the working voltage is 3.3V.
5 I/O_4 bidirectional Protected high-speed data line with a TVS clamp to GND; typical capacitance is 0.6pF (0.8pF maximum) between I/O and GND at 0V, 1MHz, and the working voltage is 3.3V.
6 I/O_5 bidirectional Protected high-speed data line with a TVS clamp to GND; typical capacitance is 0.6pF (0.8pF maximum) between I/O and GND at 0V, 1MHz, and the working voltage is 3.3V.

Key specifications

Parameter Value
Manufacturer Shenzhen JingYang
Package SOT-563
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Leakage current (I/O to GND) IR 0.1 1 μA VRWM = 5V, T = 25C; Between I/O and GND 2
Capacitance (I/O to GND) CESD 0.6 0.8 pF VR = 0V, f = 1MHz; Between I/O and GND 2
Capacitance (I/O to I/O) CESD 0.3 0.4 pF VR = 0V, f = 1MHz; Between I/O and I/O 2
Peak Pulse Current IPP 4 A tp = 8/20us 2
Operating Temperature TOPT -55 125 C 2
Storage Temperature TSTG -55 150 C 2

CAD (KiCad official)

  • Symbol: TT0515THX
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: tt0515thx-etched.step / tt0515thx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tt0515thx.step / tt0515thx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JingYang datasheet (5 pp, sha256 40078efaae6698e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF