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TT0512TMX

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Shenzhen JingYang ESD And Surge Protection (TVS/ESD), SOT-143. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TT0512TMX

Shenzhen JingYang · ESD And Surge Protection (TVS/ESD) · SOT-143

TT0512TMX from Shenzhen JingYang, in a SOT-143. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the TVS protection, shown as GND in the pin configuration on page 1; the datasheet gives no separate electrical limit for this pin.
2 IO1 bidirectional Protected data line I/O 1 with 0.6pF typical capacitance to GND and ±17kV contact / ±27kV air ESD protection per IEC 61000-4-2 (Level 4 rated on the datasheet).
3 IO2 bidirectional Protected data line I/O 2 with 0.6pF typical capacitance to GND, rated 5V nominal reverse working voltage (VRWM) and ±17kV contact / ±27kV air ESD per IEC 61000-4-2.
4 VCC power_in Supply-side pin shown as VCC in the pin configuration; the datasheet gives no voltage limit or function description for this pin.

Key specifications

Parameter Value
Manufacturer Shenzhen JingYang
Package SOT-143
Category Circuit Protection
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage (IT = 1mA, between I/O and GND) VBR 6 8 10 V IT = 1mA, between I/O and GND 2
Reverse Leakage Current (VRWM = 5V, T = 25C, between I/O and GND) IR 0.1 1 μA VRWM = 5V, T = 25C, between I/O and GND 2
Parasitic Capacitance (between I/O and GND) CESD 0.6 0.8 pF VR = 0V, f = 1MHz, between I/O and GND 2
Parasitic Capacitance (between I/O and I/O) CESD 0.3 0.4 pF VR = 0V, f = 1MHz, between I/O and I/O 2
Clamping Voltage (between I/O and GND) VC 11 V IPP = 1A, tp = 8/20μs, between I/O and GND 2
Clamping Voltage (between I/O and GND) VC 12 V IPP = 4A, tp = 8/20μs, between I/O and GND 2
ESD per IEC 61000-4-2 (Contact) VESD -17 17 kV ESD per IEC 61000-4-2 (Contact), printed ±17 kV 2
ESD per IEC 61000-4-2 (Air) -27 27 kV ESD per IEC 61000-4-2 (Air), printed ±27 kV 2
Operating Temperature TOPT -55 125 C 2
Storage Temperature TSTG -55 150 C 2
Peak Pulse Current (tp = 8/20μs) IPP 4 A tp = 8/20μs 2
Peak Pulse Power (8/20μs) PPP 48 W 8/20μs 2
Nominal Reverse Working Voltage VRWM 5 V 2

CAD (KiCad official)

  • Symbol: TT0512TMX
  • Footprint: Package_TO_SOT_SMD:SOT-143
  • 3D model: SOT-143 (KiCad packages3D, STEP)
  • 3D model files: tt0512tmx-etched.step / tt0512tmx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tt0512tmx.step / tt0512tmx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JingYang datasheet (6 pp, sha256 19b05ea5551e4d6a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF