# TT0501LEX

**Shenzhen JingYang** · ESD And Surge Protection (TVS/ESD) · SOD-323

TT0501LEX from Shenzhen JingYang, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O_1 | passive | Bidirectional TVS I/O line 1 protected against ESD up to ±30kV (air/contact) with 5.0V working voltage; interchangeable with pin 2 since the device is bi-directional. |
| 2 | I/O_2 | passive | Bidirectional TVS I/O line 2 protected against ESD up to ±30kV (air/contact) with 5.0V working voltage; interchangeable with pin 1 since the device is bi-directional. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse working voltage | VRWM |  |  | 5 | V |  | 2 |
| Reverse leakage current | IR |  |  | 0.1 | μA | VRWM = 5V, T = 25C | 2 |
| Reverse breakdown voltage | VBR | 6 |  |  | V | IT = 1mA | 2 |
| Clamping voltage | VC |  |  | 6 | V | IPP = 1A, tp = 8/20μs | 2 |
| Clamping voltage | VC |  |  | 9.5 | V | IPP = 12A, tp = 8/20μs | 2 |
| Parasitic capacitance | CESD |  |  | 15 | pF | VR = 0V, f = 1MHz | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV |  | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV |  | 2 |
| Peak Pulse Current | IPP |  |  | 12 | A | 8/20us | 2 |
| Operating Temperature | TOPT | -55 |  | 150 | °C |  | 2 |
| Storage Temperature | TSTG | -55 |  | 150 | °C |  | 2 |
| Lead Soldering Temperature | TL |  |  | 260 | °C | 10 sec. | 2 |

## CAD (KiCad official)

- Symbol: `TT0501LEX`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `tt0501lex-etched.step` / `tt0501lex-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tt0501lex.step` / `tt0501lex.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JingYang datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603131193978609664) (5 pp, sha256 `06ed40d5d9b61293`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tt0501lex-datasheet.pdf)