component
TT0301MDX
Public Made by Adomby adom
Shenzhen JingYang ESD And Surge Protection (TVS/ESD), SOD-523. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTT0301MDX
Shenzhen JingYang · ESD And Surge Protection (TVS/ESD) · SOD-523
TT0301MDX from Shenzhen JingYang, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O_1 | passive | Bidirectional TVS protection pin connected to the protected data line, 3.3V working voltage (VRWM) and 15pF typical capacitance between I/O_1 and I/O_2. |
| 2 | I/O_2 | passive | Bidirectional TVS protection pin connected to the other side of the protected data line, 3.3V working voltage (VRWM) and 15pF typical capacitance between I/O_1 and I/O_2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal Reverse Working Voltage | VRWM | 3.3 | V | 2 | |||
| Reverse Leakage Current | IR | 0.1 | 1 | μA | VRWM = 3.3V, T = 25C, between I/O_1 and I/O_2 | 2 | |
| Reverse Breakdown Voltage | VBR | 3.8 | 7 | V | IT = 1mA, between I/O_1 and I/O_2 | 2 | |
| Clamping Voltage | VC | 8 | V | IPP = 1A, tp = 8/20μs, between I/O_1 and I/O_2 | 2 | ||
| Clamping Voltage | VC | 10 | V | IPP = 9A, tp = 8/20μs, between I/O_1 and I/O_2 | 2 | ||
| Parasitic Capacitance | CESD | 15 | 18 | pF | VR = 0V, f = 1MHz, between I/O_1 and I/O_2 | 2 |
CAD (KiCad official)
- Symbol:
TT0301MDX - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
tt0301mdx-etched.step/tt0301mdx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tt0301mdx.step/tt0301mdx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JingYang datasheet (5 pp, sha256
c0e6a87fecbd88cb, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).