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TSV911AIYDT

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UMW Operational Amplifier, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

componentop-amp-cmptsv911aiydt
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Contents

README

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TSV911AIYDT

UMW · Operational Amplifier · SOP-8

TSV911AIYDT from UMW, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection. Leave floating or tie to ground; do not use as a routing node.
2 IN- input Inverting input of the op-amp. Rail-to-rail input; common-mode range (VCC-)-0.1 V to (VCC+)+0.1 V. Input bias current typ. 1 pA (max 10 pA @25 °C).
3 IN+ input Non-inverting input of the op-amp. Rail-to-rail input; common-mode range (VCC-)-0.1 V to (VCC+)+0.1 V. Input bias current typ. 1 pA (max 10 pA @25 °C).
4 VCC- power_in Negative supply rail (or ground for single-supply operation). Supply range 2.5 V to 5.5 V referenced between VCC+ and VCC-; absolute max Vcc = 6 V.
5 NC unconnected No internal connection. Leave floating or tie to ground; do not use as a routing node.
6 OUT output Rail-to-rail op-amp output. High output current capability (35 mA typ source, 32 mA typ sink at Vo=2.5 V). VOH within ~15 mV of VCC+ with 10 kΩ load.
7 VCC+ power_in Positive supply rail. Operating range 2.5 V to 5.5 V (2.3 V min for 0-125 °C), absolute max 6 V. Bypass with a 100 nF ceramic capacitor close to the pin.
8 NC unconnected No internal connection. Leave floating or tie to ground; do not use as a routing node.

Key specifications

Parameter Value
Manufacturer UMW
Package SOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TSV911AIYDTIDT
  • TSV911AIYDT
  • TSV911AIYDTILT
  • TSV911AIYDTRILT

CAD (KiCad official)

  • Symbol: TSV911AIYDT
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: tsv911aiydt-etched.step / tsv911aiydt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsv911aiydt.step / tsv911aiydt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (19 pp, sha256 d61d4009d5b8915e, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF