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Ray Publish 0.1.0 a4e7691 9d ago

TSV714IQ4T

STMICROELECTRONICS · Global Sourcing Parts · QFN-16(3x3)

TSV714IQ4T from STMICROELECTRONICS, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN1+ input Non-inverting input of amplifier 1, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
2 VCC+ power_in Positive supply, operating range 1.5 V to 5.5 V (absolute maximum 6 V).
3 NC unconnected No internal connection.
4 IN2+ input Non-inverting input of amplifier 2, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
5 IN2- input Inverting input of amplifier 2, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
6 OUT2 output Rail-to-rail output of amplifier 2.
7 OUT3 output Rail-to-rail output of amplifier 3.
8 IN3- input Inverting input of amplifier 3, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
9 IN3+ input Non-inverting input of amplifier 3, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
10 NC unconnected No internal connection.
11 VCC- power_in Negative supply or ground reference; the exposed pad may be connected to VCC- or left floating.
12 IN4+ input Non-inverting input of amplifier 4, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
13 IN4- input Inverting input of amplifier 4, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
14 OUT4 output Rail-to-rail output of amplifier 4.
15 OUT1 output Rail-to-rail output of amplifier 1.
16 IN1- input Inverting input of amplifier 1, rail-to-rail with common mode range VCC- - 0.1 V to VCC+ + 0.1 V.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer STMICROELECTRONICS
Package QFN-16(3x3)
Category Global Sourcing Parts
Pins 17

CAD (KiCad official)

  • Symbol: TSV714IQ4T
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: tsv714iq4t-etched.step / tsv714iq4t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsv714iq4t.step / tsv714iq4t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMICROELECTRONICS datasheet (29 pp, sha256 82e7f8fd6546691b, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF