# TSV632IYDT

**STMicroelectronics** · Operational Amplifier · SOIC-8

TSV632IYDT from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Out1 | output | Channel 1 rail-to-rail output, within 35 mV max of the rails into 10 kΩ and stable with up to 100 pF load in follower configuration. |
| 2 | In1- | input | Channel 1 inverting input, rail-to-rail from (VCC-) - 0.1 V to (VCC+) + 0.1 V, with input current limited to 10 mA by a series resistor. |
| 3 | In1+ | input | Channel 1 non-inverting input, rail-to-rail from (VCC-) - 0.1 V to (VCC+) + 0.1 V, with input current limited to 10 mA by a series resistor. |
| 4 | VCC- | power_in | Negative supply (ground in single-supply use); supply range VCC is 1.5 V to 5.5 V total, 10 nF decoupling advised close to the supply pins. |
| 5 | In2+ | input | Channel 2 non-inverting input, rail-to-rail from (VCC-) - 0.1 V to (VCC+) + 0.1 V, with input current limited to 10 mA by a series resistor. |
| 6 | In2- | input | Channel 2 inverting input, rail-to-rail from (VCC-) - 0.1 V to (VCC+) + 0.1 V, with input current limited to 10 mA by a series resistor. |
| 7 | Out2 | output | Channel 2 rail-to-rail output, within 35 mV max of the rails into 10 kΩ and stable with up to 100 pF load in follower configuration. |
| 8 | VCC+ | power_in | Positive supply, 1.5 V to 5.5 V operating range (6 V absolute maximum), 10 nF decoupling advised close to the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `TSV632IYDT`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `tsv632iydt-etched.step` / `tsv632iydt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tsv632iydt.step` / `tsv632iydt.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589933380293849088) (31 pp, sha256 `eb832cb8e117ac03`, retrieved 2026-10-08, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tsv632iydt-datasheet.pdf)