# TSM1B224F4153RZ

**TKS** · NTC Thermistors · 0603

TSM1B224F4153RZ from TKS, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TKS |
| Package | 0603 |
| Category | Sensors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| R25 resistance tolerance |  | -1 |  | 1 | % | Tolerance of R25, 25℃ | 5 |
| B25/50 tolerance |  | -3 |  | 3 | % | Tolerance of B value | 5 |
| Max. power dissipation at 25℃ | Pmax |  |  | 210 | mW | at 25℃ | 5 |
| Operating temperature range | TL~TU | -40 |  | 125 | ℃ |  | 5 |
| Storage temperature |  | -10 |  | 40 | ℃ | Storage conditions of products | 9 |
| Relative humidity (storage) |  |  |  | 75 | %RH | Storage conditions of products | 9 |
| Period of storage |  |  |  | 1 | year | Storage conditions of products | 9 |
| IR-reflow peak temperature |  | 255 |  | 260 | ℃ | IR-reflow soldering profile, peak temp | 7 |
| Soldering iron tip temperature |  |  |  | 360 | ℃ | Recommended reworking with soldering iron, max. | 7 |
| Soldering time with iron |  |  |  | 3 | sec | Recommended reworking with soldering iron, max. | 7 |
| Soldering iron tip diameter |  |  |  | 3 | mm | Recommended reworking with soldering iron, max. | 7 |
| Resistance change after bending strength test | /ΔR25/R25/ |  |  | 5 | % | Warp 2mm; speed <0.5mm/sec; 10 sec on PCB | 6 |
| Resistance change after resistance to soldering heat | /ΔR25/R25/ |  |  | 3 | % | 260±5℃, 10±1 sec | 6 |
| Resistance change after high temperature storage | /ΔR25/R25/ |  |  | 5 | % | 125±5℃, 1000±24 hrs | 6 |
| Resistance change after damp heat, steady state | /ΔR25/R25/ |  |  | 3 | % | 40±2℃, 90~95% RH, 1000±24 hrs | 6 |
| Resistance change after rapid change of temperature | /ΔR25/R25/ |  |  | 3 | % | 5 cycles on PCB; steps -40±5℃, room temp, 125±5℃, room temp | 6 |
| Resistance band at -40℃ (Rmin / Rnor / Rmax) | R-T | 7812.7 | 8815.6 | 9946.2 | KΩ | R-T table at -40℃ | 12 |
| Resistance band at 25℃ (Rmin / Rnor / Rmax) | R-T | 217.8 | 220 | 222.2 | KΩ | R-T table at 25℃ | 13 |
| Resistance band at 125℃ (Rmin / Rnor / Rmax) | R-T | 5.5819 | 6.2733 | 7.0496 | KΩ | R-T table at 125℃ | 16 |
| Zero power resistance at 25℃ | R25 |  | 220 |  | KΩ | 25℃ | 5 |
| B25/50 value | B25/50 |  | 4150 |  | K | B25/50 | 5 |
| Dissipation factor | δ |  | 2.1 |  | mW/℃ |  | 5 |
| Thermal time constant | τ |  | 3.1 |  | sec |  | 5 |

## CAD (KiCad official)

- Symbol: `TSM1B224F4153RZ`
- Footprint: `Resistor_SMD:R_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `tsm1b224f4153rz-etched.step` / `tsm1b224f4153rz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tsm1b224f4153rz.step` / `tsm1b224f4153rz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TKS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603039482195296256) (16 pp, sha256 `dd4772e5493c18b2`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tsm1b224f4153rz-datasheet.pdf)