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TSD05DYFR

Texas Instruments · ESD And Surge Protection (TVS/ESD) · SOD-323

TSD05DYFR from Texas Instruments, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO bidirectional I/O protected channel; for TSD05 the reverse standoff voltage VRWM is 5.5 V, maximum reverse leakage at 5.5 V is 50 nA, and the line capacitance is 19 pF typical at 0 V, 1 MHz.
2 GND power_in Ground reference pin; the TVS diode provides the clamping path from the protected I/O pin to this ground.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
反向关断电压 (VRWM) VRWM 5.5 V IIO < 50nA,在工作温度范围内 6
击穿电压 (VBR) VBR 6 V IIO = 1mA,IO 至 GND 6
反向漏电流 (ILEAK) ILEAK 5 50 nA VIO = 5.5V,IO 至 GND 6
正向电压 (VFWD) VFWD 0.7 V IIO = 1mA,GND 至 IO 6
浪涌钳位电压 (VCLAMP) VCLAMP 8 11.5 V IPP = 24A,IO 至 GND,tp = 8/20µs 6
浪涌钳位电压 (VCLAMP) VCLAMP 9 15 V IPP = 60A,IO 至 GND,tp = 8/20µs 6
浪涌钳位电压 (VCLAMP) VCLAMP 5.5 V IPP = 60A,GND 至 IO,tp = 8/20µs 6
TLP 钳位电压 VCLAMP_TLP 7.5 V IPP = 16A,IO 至 GND,tp = 100ns 6
TLP 钳位电压 VCLAMP_TLP 2.5 V IPP = 16A,GND 至 IO,tp = 100ns 6
线路电容 (CL) CL 19 pF VIO = 0V;ƒ = 1MHz,IO 至 GND 6
IEC 61000-4-5 功率 (tp 8/20µs) PPP 529 W 25°C,IEC 61000-4-5,tp = 8/20µs 4
IEC 61000-4-5 电流 (tp 8/20µs) IPP 60 A 25°C,IEC 61000-4-5,tp = 8/20µs 4
环境运行温度 TA -55 150 °C 4
存储温度 Tstg -65 155 °C 4
自然通风条件下的工作温度范围 TA -55 150 °C 自然通风条件下 4
结至环境热阻 RθJA 672 °C/W 5
结至外壳(顶部)热阻 RθJC(top) 230.5 °C/W 5
结至电路板热阻 RθJB 541.4 °C/W 5
结至顶部特征参数 ΨJT 64.4 °C/W 5
结至电路板特征参数 ΨJB 527.5 °C/W 5

CAD (KiCad official)

  • Symbol: TSD05DYFR
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: tsd05dyfr-etched.step / tsd05dyfr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsd05dyfr.step / tsd05dyfr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (16 pp, sha256 bb8001d3075611a1, retrieved 2026-10-24, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF