component
TSC212ICT
Public Made by Adomby adom
STMicroelectronics Current-Sensing Amplifiers, SC-70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTSC212ICT
STMicroelectronics · Current-Sensing Amplifiers · SC-70-6
TSC212ICT from STMicroelectronics, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | REF | input | Reference voltage input that sets the output offset, since output voltage = (Rshunt x Iload) x Gain + Vref. |
| 2 | GND | power_in | Ground. |
| 3 | Vcc | power_in | Power supply voltage, operating range 2.7 to 26 V. |
| 4 | Vin+ | power_in | Connection to the external sense resistor (positive side), common mode range -0.3 to 26 V. |
| 5 | Vin- | power_in | Connection to the external sense resistor (negative side), common mode range -0.3 to 26 V. |
| 6 | OUT | output | Output voltage, with fixed gain of 1000 V/V for the TSC212. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SC-70-6 |
| Category | Operational Amplifier/Comparator |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | Vcc | 2.7 | 26 | V | 5 | ||
| Quiescent current | Icc | 65 | 100 | µA | VSENSE = 0 mV | 5 | |
| Quiescent current over temperature | Icc | 115 | µA | Tmin. < T < Tmax. | 5 | ||
| Offset voltage (RTI) | VO | -35 | 35 | µV | TSC212, VSENSE = 0 mV | 5 | |
| Offset voltage variation vs. temperature | /ΔVO/ΔT/ | 0.05 | 0.3 | µV/°C | VSENSE = 0 mV, Tmin.< T < Tmax. | 5 | |
| Common mode rejection ratio | CMRR | 105 | 140 | dB | TSC212, VIN+= 0 to 26 V, VSENSE = 0 mV, Tmin. < T < Tmax. | 5 | |
| Power supply rejection ratio | PSRR | 0.1 | 10 | µV/V | Vcc= 2.7 to 26 V, VIN+=18 V, VSENSE = 0 mV | 5 | |
| Input bias current | IIB | 15 | 28 | 35 | µA | VSENSE = 0 mV | 5 |
| Gain error | EG | -1 | 0.02 | 1 | % | VSENSE = -5 to + 5 mV, Tmin. < T < Tmax. | 5 |
| Gain error vs. temperature | TG | 7 | 20 | ppm/°C | Tmin. < T < Tmax. | 5 | |
| Maximum capacitive load | CL | 470 | pF | No sustained oscillation | 6 | ||
| Output swing close to GND | Vsw- | 5 | 30 | mV | RL=10 kΩ to Gnd, Tmin. < T < Tmax. | 6 | |
| Supply voltage (absolute maximum) | VCC | 26 | V | 4 | |||
| Differential voltage between input pins | VIN | -26 | 26 | V | In+, In- | 4 | |
| Common mode voltage on input pins (absolute maximum) | VIN | -0.3 | 26 | V | Gnd-0.3 to 26 | 4 | |
| Input current to any pin | Iin | 5 | mA | 4 | |||
| Lead temperature | TLead | 260 | °C | 10 s | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Junction temperature | Tj | 150 | °C | 4 | |||
| ESD HBM | ESD | 4000 | V | human body model | 4 | ||
| ESD CDM | ESD | 1000 | V | charged device model | 4 | ||
| Supply voltage (operating) | VCC | 2.7 | 26 | V | 4 | ||
| Common mode voltage on input pins (operating) | Vicm | -0.3 | 26 | V | 4 | ||
| Operating free-air temperature range | T | -40 | 125 | °C | 4 | ||
| Thermal resistance junction to ambient | Rth-ja | 232 | °C/W | SC70-6, typical value | 4 | ||
| Gain | G | 1000 | V/V | TSC212 | 5 | ||
| Input offset current | IIO | 0.02 | µA | VSENSE = 0 mV | 5 | ||
| Linearity error | NLE | 0.01 | % | VSENSE = -5 to + 5 mV | 5 | ||
| Load regulation | RLoad | 0.5 | Ω | IOUT= -10 to +10 mA | 6 | ||
| Bandwidth | BW | 6 | kHz | TSC212, VCC = 5 V, Vicm = 12 V, Cl = 100 pF | 6 | ||
| Slew rate | SR | 0.05 | V/µs | TSC212, VCC = 5 V, Vicm = 12 V, Cl = 100 pF | 6 | ||
| Noise (RTI) | EN | 50 | nV/√Hz | TSC212, f = 1 kHz | 6 |
CAD (KiCad official)
- Symbol:
TSC212ICT - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SC-70-6 (KiCad packages3D, STEP)
- 3D model files:
tsc212ict-etched.step/tsc212ict-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tsc212ict.step/tsc212ict.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (38 pp, sha256
2b5f8111817ab0cf, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).