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TS820-600B-TR

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STMicroelectronics Thyristors (SCR)/Modules, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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docs ts820-600b-tr: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain… · Ray 23d ago
viewers ts820-600b-tr: viewers · Ray 1mo ago
package.json ts820-600b-tr: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain… · Ray 23d ago
page.json ts820-600b-tr: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain… · Ray 23d ago
README.md ts820-600b-tr: specified limits as data (metadata.characteristics, 21 rows from the datasheet) · Ray 25d ago
ts820-600b-tr-etched.fit.json ts820-600b-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
ts820-600b-tr-etched.glb ts820-600b-tr: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain… · Ray 23d ago
ts820-600b-tr-etched.step ts820-600b-tr: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain… · Ray 23d ago
ts820-600b-tr.glb Publish 0.1.0 · Ray 1mo ago
ts820-600b-tr.kicad_mod Publish 0.1.0 · Ray 1mo ago
ts820-600b-tr.kicad_sym Publish 0.1.0 · Ray 1mo ago
ts820-600b-tr.lbr Publish 0.1.0 · Ray 1mo ago
ts820-600b-tr.step Publish 0.1.0 · Ray 1mo ago

TS820-600B-TR

STMicroelectronics · Thyristors (SCR)/Modules · DPAK

TS820-600B-TR from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate control input terminal; triggers the SCR into conduction with maximum gate trigger current IGT of 200 µA and maximum gate trigger voltage VGT of 0.8 V.
2 Anode passive Anode main current input terminal; rated for repetitive peak off-state voltage VDRM/VRRM of 600 V and RMS on-state current IT(RMS) of 8 A at case temperature TC of 110 °C.
3 Cathode power_in Cathode main return terminal providing the return current path when device conducts; rated for operating junction temperature from -40 to +125 °C.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DPAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Tolerance-free limit: IGT gate trigger current IGT 200 µA VD = 12 V, RL = 140 Ω 2
Gate trigger voltage VGT 0.8 V 2
Reverse gate voltage (breakdown) VRG 8 V IRG = 10 µA 2
Gate non-trigger voltage VGD 0.1 V VD = VDRM, RL = 3.3 kΩ, RGK = 220 Ω, Tj = 125 °C 2
Holding current IH 5 mA IT = 50 mA, RGK = 1 kΩ 2
Latching current IL 6 mA IG = 1 mA, RGK = 1 kΩ 2
Critical rate of rise of off-state voltage dV/dt 5 V/µs VD = 65% VDRM, RGK = 220 Ω, Tj = 125 °C 2
On-state voltage VTM 1.6 V ITM = 16 A, tp = 380 µs, Tj = 25 °C 2
Threshold voltage Vt0 0.85 V Tj = 125 °C 2
Dynamic resistance Rd 46 mΩ Tj = 125 °C 2
Repetitive peak off-state current IDRM 5 µA VDRM = VRRM, RGK = 220 Ω, Tj = 25 °C 2
Repetitive peak reverse current IRRM 1 mA VDRM = VRRM, RGK = 220 Ω, Tj = 125 °C 2
RMS on-state current IT(RMS) 8 A 180° conduction angle, TC = 110 °C 2
Average on-state current IT(AV) 5 A 180° conduction angle, TC = 110 °C 2
Critical rate of rise of on-state current dI/dt 50 A/µs IG = 2 x IGT, tr ≤ 100 ns, F = 60 Hz, Tj = 125 °C 2
Peak gate current IGM 4 A tp = 20 µs, Tj = 125 °C 2
Average gate power dissipation PG(AV) 1 W Tj = 125 °C 2
Storage junction temperature range Tstg -40 150 °C 2
Operating junction temperature range Tj -40 125 °C 2
Junction to case (DC) Rth(j-c) 1.3 °C/W DPAK (IPAK / DPAK / TO-220AB), DC 3
Junction to ambient Rth(j-a) 70 °C/W DPAK, S = 0.5 cm² copper surface under tab 3

CAD (KiCad official)

  • Symbol: TS820-600B-TR
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: ts820-600b-tr-etched.step / ts820-600b-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ts820-600b-tr.step / ts820-600b-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (20 pp, sha256 90a411e20256cd54, retrieved 2026-09-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF