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TS0511LEX
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Shenzhen JingYang ESD And Surge Protection (TVS/ESD), SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TS0511LEX
Shenzhen JingYang · ESD And Surge Protection (TVS/ESD) · SOD-323
TS0511LEX from Shenzhen JingYang, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | passive | Protected I/O line (bidirectional); the device clamps transients such as ESD of ±30kV air/contact per IEC61000-4-2 and 350W peak pulse power (8/20µs). |
| 2 | GND | power_in | Ground reference pin of the SOD323 TVS diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | 5 | V | 2 | |||
| Breakdown voltage | VB | 6 | V | @ IT = 1 mA | 2 | ||
| Test current | IT | 1 | mA | 2 | |||
| Clamping voltage @1A | VC@1A | 10 | V | IPP = 1 A | 2 | ||
| Clamping voltage | VC | 24 | V | @ 19 A | 2 | ||
| Reverse leakage current | IR | 0.1 | µA | 2 | |||
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | kV | 2 | ||
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | 30 | kV | 2 | ||
| Peak Pulse Power | PPP | 350 | W | 8/20μs | 2 | ||
| Operating Temperature | TOPT | -55 | 150 | ℃ | 2 | ||
| Storage Temperature | TSTG | -55 | 150 | ℃ | 2 | ||
| Lead Soldering Temperature | TL | 260 | ℃ | 10 sec. | 2 |
CAD (KiCad official)
- Symbol:
TS0511LEX - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
ts0511lex-etched.step/ts0511lex-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ts0511lex.step/ts0511lex.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JingYang datasheet (4 pp, sha256
886dc4b8ec3e96a7, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TS0511LEX
**Shenzhen JingYang** · ESD And Surge Protection (TVS/ESD) · SOD-323
TS0511LEX from Shenzhen JingYang, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | passive | Protected I/O line (bidirectional); the device clamps transients such as ESD of ±30kV air/contact per IEC61000-4-2 and 350W peak pulse power (8/20µs). |
| 2 | GND | power_in | Ground reference pin of the SOD323 TVS diode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | | | 5 | V | | 2 |
| Breakdown voltage | VB | 6 | | | V | @ IT = 1 mA | 2 |
| Test current | IT | | | 1 | mA | | 2 |
| Clamping voltage @1A | VC@1A | | | 10 | V | IPP = 1 A | 2 |
| Clamping voltage | VC | | | 24 | V | @ 19 A | 2 |
| Reverse leakage current | IR | | | 0.1 | µA | | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | | 30 | kV | | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | | 30 | kV | | 2 |
| Peak Pulse Power | PPP | | | 350 | W | 8/20μs | 2 |
| Operating Temperature | TOPT | -55 | | 150 | ℃ | | 2 |
| Storage Temperature | TSTG | -55 | | 150 | ℃ | | 2 |
| Lead Soldering Temperature | TL | | | 260 | ℃ | 10 sec. | 2 |
## CAD (KiCad official)
- Symbol: `TS0511LEX`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `ts0511lex-etched.step` / `ts0511lex-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ts0511lex.step` / `ts0511lex.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Shenzhen JingYang datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603165583403991040) (4 pp, sha256 `886dc4b8ec3e96a7`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ts0511lex-datasheet.pdf)