# TS0301TEX

**Shenzhen JingYang** · ESD And Surge Protection (TVS/ESD) · SOD-323

TS0301TEX from Shenzhen JingYang, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O 1 | passive | Bidirectional TVS terminal 1 (device is directionless), connect to the protected I/O line; TS0301TEX has VRWM 3.3V max, VB 4.0V min, ESD ±30kV air/contact per IEC 61000-4-2. |
| 2 | I/O 2 | passive | Bidirectional TVS terminal 2 (device is directionless), connect to ground or the other side of the protected line; either orientation works, the datasheet states orientation in tape is not required. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off (working) voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Breakdown voltage | VB | 4 |  |  | V | Electrical characteristics at 25°C (table header) | 2 |
| Clamping voltage at 1 A | VC@1A |  |  | 8 | V | @ 1 A | 2 |
| Clamping voltage | VC |  |  | 16 | V | @ 20 A | 2 |
| Reverse leakage current | IR |  |  | 50 | nA |  | 2 |
| Capacitance | CT |  | 0.9 |  | pF |  | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Air) | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Contact) | 2 |
| Operating Temperature | TOPT | -55 |  | 150 | °C |  | 2 |
| Storage Temperature | TSTG | -55 |  | 150 | °C |  | 2 |
| Lead Soldering Temperature | TLST |  |  | 260 | °C |  | 2 |

## CAD (KiCad official)

- Symbol: `TS0301TEX`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `ts0301tex-etched.step` / `ts0301tex-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ts0301tex.step` / `ts0301tex.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JingYang datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757922498371969024) (6 pp, sha256 `f1617dcef2fc7ebc`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ts0301tex-datasheet.pdf)