component
TRSF3232EIRGTR
Public Made by Adomby adom
Texas Instruments RS232 ICs, VQFN-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTRSF3232EIRGTR
Texas Instruments · RS232 ICs · VQFN-16(3x3)
TRSF3232EIRGTR from Texas Instruments, in a VQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 16 | C1+ | passive | Positive lead of C1 capacitor. |
| 15 | V+ | power_out | Positive charge pump output for storage capacitor only. |
| 1 | C1- | passive | Negative lead of C1 capacitor. |
| 2 | C2+ | passive | Positive lead of C2 capacitor. |
| 3 | C2- | passive | Negative lead of C2 capacitor. |
| 4 | V- | power_out | Negative charge pump output for storage capacitor only. |
| 5 | DOUT2 | output | RS232 line data output (to remote RS232 system). |
| 6 | RIN2 | input | RS232 line data input (from remote RS232 system); includes an internal standard RS232 load. |
| 7 | ROUT2 | output | Logic data output (to UART); an open RIN input results in a high output on ROUT. |
| 8 | DIN2 | input | Logic data input (from UART); must be driven to a valid high or low logic level, accepts up to 5.5V for 5V logic compatibility at 3.3V VCC. |
| 9 | DIN1 | input | Logic data input (from UART); must be driven to a valid high or low logic level, accepts up to 5.5V for 5V logic compatibility at 3.3V VCC. |
| 10 | ROUT1 | output | Logic data output (to UART); an open RIN input results in a high output on ROUT. |
| 11 | RIN1 | input | RS232 line data input (from remote RS232 system); includes an internal standard RS232 load. |
| 12 | DOUT1 | output | RS232 line data output (to remote RS232 system). |
| 13 | GND | power_in | Ground. |
| 14 | VCC | power_in | Supply voltage; connect to an external 3-V to 5.5-V power supply. |
| 17 | Thermal Pad | passive | Exposed thermal pad; can be connected to GND or left floating, must be soldered to the PCB for thermal and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-16(3x3) |
| Category | Interface |
| Pins | 17 |
CAD (KiCad official)
- Symbol:
TRSF3232EIRGTR - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: VQFN-16(3x3) (KiCad packages3D, STEP)
- 3D model files:
trsf3232eirgtr-etched.step/trsf3232eirgtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);trsf3232eirgtr.step/trsf3232eirgtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (40 pp, sha256
8ddc69e39dc6d15f, retrieved 2026-09-24, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).