component
TRF7962ARHBR
Public Made by Adomby adom
Texas Instruments RFID ICs, HVQFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTRF7962ARHBR
Texas Instruments · RFID ICs · HVQFN-32-EP(5x5)
TRF7962ARHBR from Texas Instruments, in a HVQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD_A | power_out | Internally regulated supply output of 2.7 V to 3.4 V for the analog circuitry. |
| 2 | VIN | power_in | External supply input to the chip, 2.7 V to 5.5 V. |
| 3 | VDD_RF | power_out | Internally regulated supply output of 2.7 V to 5 V, normally connected to VDD_PA (pin 4). |
| 4 | VDD_PA | power_in | Supply input for the power amplifier, normally connected externally to VDD_RF (pin 3). |
| 5 | TX_OUT | output | RF output with selectable output power of 100 mW or 200 mW when VDD = 5 V. |
| 6 | VSS_PA | power_in | Negative supply for the power amplifier, normally connected to circuit ground. |
| 7 | VSS_RX | power_in | Negative supply for the receive inputs, normally connected to circuit ground. |
| 8 | RX_IN1 | input | Main receive input. |
| 9 | RX_IN2 | input | Auxiliary receive input. |
| 10 | VSS | power_in | Chip substrate ground. |
| 11 | BAND_GAP | output | Internal analog voltage reference output, bandgap voltage VBG = 1.6 V. |
| 12 | ASK/OOK | bidirectional | Selects ASK (0) or OOK (1) modulation for direct modes 0 and 1; can also be configured as an output providing the received analog signal. |
| 13 | IRQ | output | Interrupt request output to the MCU. |
| 14 | MOD | bidirectional | External data modulation input for direct mode 0 or 1, and subcarrier digital data output (see registers 0x1A and 0x1B). |
| 15 | VSS_A | power_in | Negative supply for the internal analog circuits, connected to GND. |
| 16 | VDD_I/O | power_in | Supply for the I/O communication level shifter, 1.8 V up to VIN; VIN must never be exceeded. |
| 17 | I/O_0 | bidirectional | I/O pin for parallel communication; hard-wired (with I/O_1 and I/O_2) to select the SPI mode when SPI is used. |
| 18 | I/O_1 | bidirectional | I/O pin for parallel communication; hard-wired (with I/O_0 and I/O_2) to select the SPI mode when SPI is used. |
| 19 | I/O_2 | bidirectional | I/O pin for parallel communication; hard-wired (with I/O_0 and I/O_1) to select the SPI mode when SPI is used. |
| 20 | I/O_3 | bidirectional | I/O pin for parallel communication. |
| 21 | I/O_4 | bidirectional | I/O pin for parallel communication; serves as slave select (active low) in SPI mode. |
| 22 | I/O_5 | bidirectional | I/O pin for parallel communication; serves as data clock output in direct mode 1. |
| 23 | I/O_6 | bidirectional | I/O pin for parallel communication; serves as MISO in SPI mode and as serial bit data output in direct mode 1 or subcarrier signal in direct mode 0. |
| 24 | I/O_7 | bidirectional | I/O pin for parallel communication; serves as MOSI in SPI mode. |
| 25 | EN2 | input | Selects power-down mode; if connected to VIN, VDD_X remains active during power-down mode 2. |
| 26 | DATA_CLK | input | Data clock input for MCU communication, parallel and serial. |
| 27 | SYS_CLK | output | System clock output for the MCU: with EN = 1 set by register 0x09 (off, 3.39 MHz, 6.78 MHz or 13.56 MHz); 60 kHz when EN = 0 and EN2 = 1. |
| 28 | EN | input | Chip enable input; when EN = 0 the chip is in sleep or power-down mode. |
| 29 | VSS_D | power_in | Negative supply for the internal digital circuits. |
| 30 | OSC_OUT | output | Crystal or oscillator output; can be left open when an external clock is applied to OSC_IN. |
| 31 | OSC_IN | input | Crystal or oscillator input for the 13.56 MHz system clock; an external clock source can be connected here. |
| 32 | VDD_X | power_out | Internally regulated supply output of 2.7 V to 3.4 V for digital circuits and external devices such as an MCU. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVQFN-32-EP(5x5) |
| Category | RF And Wireless |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
TRF7962ARHBR - Footprint:
Package_DFN_QFN:HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm - 3D model: HVQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
trf7962arhbr-etched.step/trf7962arhbr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);trf7962arhbr.step/trf7962arhbr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (73 pp, sha256
7af772dcfc3be925, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).