component
TRF37C75IDSGR
Public Made by Adomby adom
Texas Instruments RF Amplifiers, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TRF37C75IDSGR
Texas Instruments · RF Amplifiers · WSON-8-EP(2x2)
TRF37C75IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC bias supply pin for the amplifier; the datasheet recommends a 4.5 V to 5.25 V supply (5 V nominal). |
| 2 | RFIN | input | RF input, to be connected to the RF source through a DC-blocking capacitor; internally matched to 50 Ω. |
| 3 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 4 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 5 | PWDN | input | Power-down control: high puts the device in power-down state, while low or NC leaves it active; an internal pulldown resistor to GND is present. |
| 6 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 7 | RFOUT | output | RF output and DC bias (VCC): feed VCC through an RF choke inductor and take the RF output through a DC-blocking capacitor; internally matched to 50 Ω. |
| 8 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 9 | GND | power_in | Exposed PowerPAD serving as the RF and DC ground; it must be soldered to the PCB ground plane for thermal and electrical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | RF And Wireless |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TRF37C75IDSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
trf37c75idsgr-etched.step/trf37c75idsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);trf37c75idsgr.step/trf37c75idsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (19 pp, sha256
fd7f0929e238734d, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TRF37C75IDSGR
**Texas Instruments** · RF Amplifiers · WSON-8-EP(2x2)
TRF37C75IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC bias supply pin for the amplifier; the datasheet recommends a 4.5 V to 5.25 V supply (5 V nominal). |
| 2 | RFIN | input | RF input, to be connected to the RF source through a DC-blocking capacitor; internally matched to 50 Ω. |
| 3 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 4 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 5 | PWDN | input | Power-down control: high puts the device in power-down state, while low or NC leaves it active; an internal pulldown resistor to GND is present. |
| 6 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 7 | RFOUT | output | RF output and DC bias (VCC): feed VCC through an RF choke inductor and take the RF output through a DC-blocking capacitor; internally matched to 50 Ω. |
| 8 | NC | unconnected | No electrical connection; the datasheet says to connect the pad to GND for board-level reliability. |
| 9 | GND | power_in | Exposed PowerPAD serving as the RF and DC ground; it must be soldered to the PCB ground plane for thermal and electrical performance. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | RF And Wireless |
| Pins | 9 |
## CAD (KiCad official)
- Symbol: `TRF37C75IDSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `trf37c75idsgr-etched.step` / `trf37c75idsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `trf37c75idsgr.step` / `trf37c75idsgr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/trf37c75) (19 pp, sha256 `fd7f0929e238734d`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/trf37c75idsgr-datasheet.pdf)