component
TRF37C73IDSGR
Public Made by Adomby adom
Texas Instruments RF Amplifiers, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TRF37C73IDSGR
Texas Instruments · RF Amplifiers · WSON-8-EP(2x2)
TRF37C73IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC power supply input; nominally 3.3V with operating range 3V to 3.45V. |
| 2 | RFIN | input | RF input internally matched to 50Ω; connect to source through DC-blocking capacitor. |
| 3 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 4 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 5 | PWDN | input | Power down control with internal pulldown resistor to GND; high logic level disables device. |
| 6 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 7 | RFOUT | output | RF output internally matched to 50Ω; connect to load through DC-blocking capacitor and to VCC through RF choke inductor. |
| 8 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 9 | GND | power_in | PowerPAD thermal pad for RF and DC ground; must be soldered to PCB ground plane for thermal and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Radio Frequency Chip/Antenna |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TRF37C73IDSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
trf37c73idsgr-etched.step/trf37c73idsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);trf37c73idsgr.step/trf37c73idsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (19 pp, sha256
9a5d5bc01f7d2ea7, retrieved 2026-10-07, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TRF37C73IDSGR
**Texas Instruments** · RF Amplifiers · WSON-8-EP(2x2)
TRF37C73IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC power supply input; nominally 3.3V with operating range 3V to 3.45V. |
| 2 | RFIN | input | RF input internally matched to 50Ω; connect to source through DC-blocking capacitor. |
| 3 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 4 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 5 | PWDN | input | Power down control with internal pulldown resistor to GND; high logic level disables device. |
| 6 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 7 | RFOUT | output | RF output internally matched to 50Ω; connect to load through DC-blocking capacitor and to VCC through RF choke inductor. |
| 8 | NC | unconnected | No electrical connection; connect pad to GND for board level reliability. |
| 9 | GND | power_in | PowerPAD thermal pad for RF and DC ground; must be soldered to PCB ground plane for thermal and mechanical performance. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Radio Frequency Chip/Antenna |
| Pins | 9 |
## CAD (KiCad official)
- Symbol: `TRF37C73IDSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `trf37c73idsgr-etched.step` / `trf37c73idsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `trf37c73idsgr.step` / `trf37c73idsgr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/trf37c73) (19 pp, sha256 `9a5d5bc01f7d2ea7`, retrieved 2026-10-07, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/trf37c73idsgr-datasheet.pdf)