# TRF37B75IDSGR

**Texas Instruments** · RF Amplifiers · WSON-8-EP(2x2)

TRF37B75IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC bias supply pin; the recommended supply is 4.5 V to 5.25 V (5 V nominal), and the absolute maximum supply input is 6 V. |
| 2 | RFIN | input | RF input, to be connected to the RF source through a DC-blocking capacitor; internally matched to 50 Ω. |
| 3 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 4 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 5 | PWDN | input | Power-down control: when high the device is in power-down state, and when low or not connected it is active; it has an internal pulldown to GND, with VIH of 2 V minimum and VIL of 0.8 V maximum. |
| 6 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 7 | RFOUT | output | RF output and DC bias (VCC): connect to the DC supply through an RF choke inductor and to the output load through a DC-blocking capacitor; internally matched to 50 Ω. |
| 8 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 9 | GND | power_in | PowerPAD RF and DC ground; connect to the PCB ground plane, and the pad must be soldered to the board for thermal and mechanical performance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Radio Frequency Chip/Antenna |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `TRF37B75IDSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `trf37b75idsgr-etched.step` / `trf37b75idsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `trf37b75idsgr.step` / `trf37b75idsgr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/trf37b75) (19 pp, sha256 `81542f240a68581c`, retrieved 2026-10-11, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/trf37b75idsgr-datasheet.pdf)