component
TPSP1003-01ETG
Public Made by Adomby adom
TECH PUBLIC ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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TPSP1003-01ETG
TECH PUBLIC · ESD Protection Devices · DFN1006-2
TPSP1003-01ETG from TECH PUBLIC, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECH PUBLIC |
| Package | DFN1006-2 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working peak reverse voltage | VRWM | 5 | V | 2 | |||
| Maximum reverse leakage current | IR | 1 | μA | @ VRWM | 2 | ||
| Breakdown voltage | VBR | 6.2 | 8.5 | V | @ IT (Note 2) | 2 | |
| Clamping voltage | VC | 12.3 | V | @ Max IPP (Note 3) | 2 | ||
| Peak power dissipation | PPK | 100 | W | (8*20 μs) | 2 | ||
| Capacitance | C | 75 | pF | VR = 0 and f = 1.0 MHz | 2 | ||
| IEC 61000-4-2 (ESD) immunity, air and contact discharge | -30 | 30 | kV | Air discharge and contact discharge, IEC 61000-4-2 | 2 | ||
| Total power dissipation on FR-5 board | PD | 150 | mW | @ TA=25℃ (Note 1) | 2 | ||
| Junction and storage temperature range | TJ,TSTG | -55 | 150 | ℃ | 2 | ||
| Lead solder temperature (maximum) | TL | 260 | ℃ | 10 second duration | 2 | ||
| Operating voltage | 5 | V | Application operating voltage as stated in Features | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Lead Finish: Matte Tin l Cellular phones audio | 1 |
CAD (KiCad official)
- Symbol:
TPSP1003-01ETG - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
tpsp1003-01etg-etched.step/tpsp1003-01etg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpsp1003-01etg.step/tpsp1003-01etg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECH PUBLIC datasheet (4 pp, sha256
5207e5cbac230781, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPSP1003-01ETG
**TECH PUBLIC** · ESD Protection Devices · DFN1006-2
TPSP1003-01ETG from TECH PUBLIC, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECH PUBLIC |
| Package | DFN1006-2 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working peak reverse voltage | VRWM | | | 5 | V | | 2 |
| Maximum reverse leakage current | IR | | | 1 | μA | @ VRWM | 2 |
| Breakdown voltage | VBR | 6.2 | | 8.5 | V | @ IT (Note 2) | 2 |
| Clamping voltage | VC | | | 12.3 | V | @ Max IPP (Note 3) | 2 |
| Peak power dissipation | PPK | | 100 | | W | (8*20 μs) | 2 |
| Capacitance | C | | 75 | | pF | VR = 0 and f = 1.0 MHz | 2 |
| IEC 61000-4-2 (ESD) immunity, air and contact discharge | | -30 | | 30 | kV | Air discharge and contact discharge, IEC 61000-4-2 | 2 |
| Total power dissipation on FR-5 board | PD | | | 150 | mW | @ TA=25℃ (Note 1) | 2 |
| Junction and storage temperature range | TJ,TSTG | -55 | | 150 | ℃ | | 2 |
| Lead solder temperature (maximum) | TL | | | 260 | ℃ | 10 second duration | 2 |
| Operating voltage | | | 5 | | V | Application operating voltage as stated in Features | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Lead Finish: Matte Tin l Cellular phones audio | 1 |
## CAD (KiCad official)
- Symbol: `TPSP1003-01ETG`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `tpsp1003-01etg-etched.step` / `tpsp1003-01etg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpsp1003-01etg.step` / `tpsp1003-01etg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TECH PUBLIC datasheet](docs/tpsp1003-01etg-datasheet.pdf) (4 pp, sha256 `5207e5cbac230781`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpsp1003-01etg-datasheet.pdf)