# TPS92560DGQ

**Texas Instruments** · LED Drivers · HVSSOP-10-EP

TPS92560DGQ from Texas Instruments, in a HVSSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | output | Gate driver output pin; connect to the Gate terminal of the low-side N-channel Power FET. |
| 2 | SRC | input | Gate driver return; connect to the Source terminal of the low-side N-channel Power FET (absolute maximum -0.3 to 5 V). |
| 3 | VCC | power_out | VCC regulator output; connect a 0.47-µF decoupling capacitor from this pin to the SRC pin (absolute maximum -0.3 to 12 V). |
| 4 | SEN | input | Kelvin-sense current sensing input that connects to the current sensing resistor RSEN (absolute maximum -0.3 to 5 V). |
| 5 | GND | power_in | Analog ground, the reference point for current sensing. |
| 6 | ADJ | input | LED current adjust pin; connect to a resistor divider from the LED top voltage rail to set LED current (absolute maximum -0.3 to 5 V). |
| 7 | VP | power_in | Power supply of the IC, recommended 6.5 to 42 V; connect to the LED top voltage rail (boost) or through a diode from the LED top voltage rail (SEPIC). |
| 8 | AC2 | input | Power return terminal; connect to AC or DC input terminal (absolute maximum -1 to 45 V). |
| 9 | PGND | power_in | Power ground; connect to system ground plane. |
| 10 | AC1 | input | Power return terminal; connect to AC or DC input terminal (absolute maximum -1 to 45 V). |
| 11 | PowerPAD | passive | Thermal DAP; connect to system ground plane for heat dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-10-EP |
| Category | LED Drivers |
| Pins | 11 |

## CAD (KiCad official)

- Symbol: `TPS92560DGQ`
- Footprint: `Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm`
- 3D model: HVSSOP-10-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tps92560dgq-etched.step` / `tps92560dgq-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps92560dgq.step` / `tps92560dgq.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps92560) (29 pp, sha256 `5dc7cb145250d75a`, retrieved 2026-10-07, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tps92560dgq-datasheet.pdf)