Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

TPS7A4701RGWT

Texas Instruments · Global Sourcing Parts · VQFN-20-EP(5x5)

TPS7A4701RGWT from Texas Instruments, in a VQFN-20-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage; minimum 10µF capacitor required between OUT and GND for stability; 47µF ceramic capacitor strongly recommended as close to device as possible.
2 NC unconnected No connect pin; may remain floating or be connected to any voltage between GND and IN.
3 SENSE/FB input Control loop error amplifier input (TPS7A4701); must connect to OUT for ANY-OUT mode operation; for adjustable mode, this is FB pin used with external feedback resistors to set output voltage.
4 6P4V2 input Output offset programming pin (low-active); adds 6.4V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
5 6P4V1 input Output offset programming pin (low-active); adds 6.4V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
6 3P2V input Output offset programming pin (low-active); adds 3.2V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
7 GND power_in Ground reference and internal connection point for thermal pad; thermal pad must be soldered to large copper ground plane area for optimal thermal and mechanical performance.
8 1P6V input Output offset programming pin (low-active); adds 1.6V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
9 0P8V input Output offset programming pin (low-active); adds 0.8V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
10 0P4V input Output offset programming pin (low-active); adds 0.4V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
11 0P2V input Output offset programming pin (low-active); adds 0.2V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
12 0P1V input Output offset programming pin (low-active); adds 0.1V to nominal output voltage when connected to GND; leave floating if unused; do not connect voltages other than GND.
13 EN input Enable input (CMOS logic-compatible); device enabled when voltage exceeds VEN(HI) threshold of 2.0V typical; connect to IN if independent enable control not required.
14 NR input Noise reduction pin; connect capacitor ≥10nF to GND for stability; 1µF ceramic capacitor recommended as close to device as possible for optimized AC performance and maximized RMS noise reduction.
15 IN power_in Input power supply (+3V to +36V); minimum 1µF capacitor required between IN and GND for stability; 10µF capacitor recommended as close to device as possible to reduce PCB layout sensitivity.
16 IN power_in Input power supply (+3V to +36V); minimum 1µF capacitor required between IN and GND for stability; 10µF capacitor recommended as close to device as possible to reduce PCB layout sensitivity.
17 NC unconnected No connect pin; may remain floating or be connected to any voltage between GND and IN.
18 NC unconnected No connect pin; may remain floating or be connected to any voltage between GND and IN.
19 NC unconnected No connect pin; may remain floating or be connected to any voltage between GND and IN.
20 OUT power_out Regulated output voltage; minimum 10µF capacitor required between OUT and GND for stability; 47µF ceramic capacitor strongly recommended as close to device as possible.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-20-EP(5x5)
Category Global Sourcing Parts
Pins 21

CAD (KiCad official)

  • Symbol: TPS7A4701RGWT
  • Footprint: Package_DFN_QFN:QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
  • 3D model: VQFN-20-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps7a4701rgwt-etched.step / tps7a4701rgwt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps7a4701rgwt.step / tps7a4701rgwt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 8abb7994a91c0d4e, retrieved 2026-09-26, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF