component
TPS78518QKVURQ1
Public Made by Adomby adom
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, TO-252-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| README.md | 17d ago |
| tps78518qkvurq1-etched.glb | 17d ago |
| tps78518qkvurq1-etched.step | 17d ago |
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TPS78518QKVURQ1
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252-4
TPS78518QKVURQ1 from Texas Instruments, in a TO-252-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | EN | input | Enable pin: driving it to logic high enables the device and driving it to logic low disables it, and it must not be left floating (if unused, connect EN to IN). |
| 2 | IN | input | Input pin: place the nominal recommended ceramic capacitor or larger from IN to GND as close to the device as possible, per the Recommended Operating Conditions table. |
| 3 | GND | power_in | Ground pin that must be connected to ground on the board; the thermal pad is electrically connected to this pin. |
| 4 | OUT | output | Output pin requiring a minimum of 0.47 µF effective capacitance to ground for stability, with a 1 µF or larger ceramic capacitor recommended for best transient response. |
| 5 | NC | unconnected | No-connect pin that is not internally connected; connect to ground for best thermal performance or leave floating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TO-252-4 |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | 1.7 | 6 | V | 6 | ||
| Output voltage (fixed option) | VOUT | 0.65 | 5 | V | Fixed output | 6 | |
| Output accuracy | VOUT | -0.5 | 0.5 | % | 1 mA ≤ IOUT ≤ 1 A, VOUT(nom)+0.75 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; TJ = 25°C | 7 | |
| Output accuracy | VOUT | -1 | 1 | % | 1 mA ≤ IOUT ≤ 1 A, VOUT(nom)+0.75 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 85°C | 7 | |
| Output accuracy | VOUT | -1.7 | 1.7 | % | 1 mA ≤ IOUT ≤ 1 A, VOUT(nom)+0.75 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 150°C | 7 | |
| Load regulation | VOUT | -7.5 | 7.5 | mV | 0.1 mA ≤ IOUT ≤ 1 A; –40°C ≤ TJ ≤ 85°C | 7 | |
| Load regulation (VOUT ≤ 3.3 V) | VOUT | -7.5 | 15 | mV | 0.1 mA ≤ IOUT ≤ 1 A, –40°C ≤ TJ ≤ 150°C, VOUT ≤ 3.3 V | 7 | |
| UVLO threshold, VIN rising | VUVLO | 1.28 | 1.42 | 1.62 | V | VIN rising | 8 |
| UVLO threshold, VIN falling | VUVLO | 1.17 | 1.29 | 1.42 | V | VIN falling | 8 |
| Ground current | IGND | 15 | 25 | 33 | µA | IOUT = 0 mA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; TJ = 25°C | 7 |
| Ground current | IGND | 35 | µA | IOUT = 0 mA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 85°C | 7 | ||
| Ground current | IGND | 40 | µA | IOUT = 0 mA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 150°C | 7 | ||
| Ground current | IGND | 33 | 44 | µA | IOUT = 500 µA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; TJ = 25°C | 7 | |
| Ground current | IGND | 47 | µA | IOUT = 500 µA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 85°C | 7 | ||
| Ground current | IGND | 50 | µA | IOUT = 500 µA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 150°C | 7 | ||
| Ground current | IGND | 45 | µA | IOUT = 100 µA, VOUT(nom)+0.5 V or 2.0 V (whichever greater) ≤ VIN ≤ 6.0 V; –40°C ≤ TJ ≤ 85°C | 7 | ||
| Shutdown current | ISHDN | 0.01 | 0.05 | µA | VEN ≤ 0.3 V; TJ = 25°C | 7 | |
| Shutdown current | ISHDN | 0.25 | µA | VEN ≤ 0.3 V; –40°C ≤ TJ ≤ 85°C | 7 | ||
| Shutdown current | ISHDN | 3 | µA | VEN ≤ 0.3 V; –40°C ≤ TJ ≤ 150°C | 7 | ||
| Output current limit | ICL | 1.04 | 1.65 | A | VIN = VOUT(nom)+1.25 V or 2.0 V (whichever greater), VOUT = 0.9 x VOUT(nom) | 7 | |
| Dropout voltage (KVU package) | VDO | 540 | mV | IOUT = 1 A, VOUT = 0.95 x VOUT(nom); 1.8 V ≤ VOUT < 2.5 V | 8 | ||
| Dropout voltage (KVU package) | VDO | 500 | mV | IOUT = 850 mA, VOUT = 0.95 x VOUT(nom); VOUT = 1.8 V | 8 | ||
| Start-up time | tSTR | 280 | 550 | 785 | µs | From EN low-to-high transition to VOUT = VOUT(nom) x 92% | 8 |
| EN pin logic high voltage | VEN(HI) | 0.9 | V | 8 | |||
| EN pin logic low voltage | VEN(LOW) | 0.3 | V | 8 | |||
| Enable pin current | IEN | 10 | nA | VIN = VEN = 6.0 V | 8 | ||
| Enable voltage | VEN | 0 | 6 | V | 6 | ||
| Output current | IOUT | 0 | 1 | A | 6 | ||
| Input capacitor | CIN | 0.1 | 1 | µF | 6 | ||
| Output capacitor | COUT | 1 | 200 | µF | 6 | ||
| Feed-forward capacitor | CFF | 0 | 10 | 100 | nF | 6 | |
| Output capacitor ESR | COUT,ESR | 0.001 | 1 | Ω | 6 | ||
| Enable toggle frequency | FEN | 10 | kHz | 6 | |||
| Junction temperature (operating) | TJ | -40 | 150 | °C | 6 | ||
| Supply voltage | VIN | -0.3 | 6.5 | V | Absolute maximum, with respect to GND | 5 | |
| Enable voltage | VEN | -0.3 | 6.5 | V | Absolute maximum | 5 | |
| Output voltage | VOUT | -0.3 | V | Maximum is VIN + 0.3 V or 6.5 V, whichever is smaller | 5 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | Absolute maximum | 5 | |
| Storage temperature | Tstg | -65 | 150 | °C | Absolute maximum | 5 | |
| Thermal shutdown temperature | TSD(shutdown) | 170 | °C | Shutdown, temperature increasing | 8 | ||
| Thermal shutdown reset temperature | TSD(reset) | 155 | °C | Reset, temperature decreasing | 8 | ||
| Short-circuit current limit | ISC | 550 | mA | VOUT = 0 V | 7 | ||
| Junction-to-ambient thermal resistance (KVU) | RθJA | 31.6 | °C/W | KVU (TO-252), 5-pin | 6 | ||
| Junction-to-case (top) thermal resistance (KVU) | RθJC(top) | 40.4 | °C/W | KVU (TO-252), 5-pin | 6 | ||
| Junction-to-board thermal resistance (KVU) | RθJB | 10.4 | °C/W | KVU (TO-252), 5-pin | 6 | ||
| Junction-to-top characterization parameter (KVU) | ψJT | 4.6 | °C/W | KVU (TO-252), 5-pin | 6 | ||
| Junction-to-board characterization parameter (KVU) | ψJB | 10.3 | °C/W | KVU (TO-252), 5-pin | 6 | ||
| Junction-to-case (bottom) thermal resistance (KVU) | RθJC(bot) | 3.3 | °C/W | KVU (TO-252), 5-pin | 6 |
CAD (KiCad official)
- Symbol:
TPS78518QKVURQ1 - Footprint:
Package_TO_SOT_SMD:TO-252-4 - 3D model: TO-252-4 (KiCad packages3D, STEP)
- 3D model files:
tps78518qkvurq1-etched.step/tps78518qkvurq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps78518qkvurq1.step/tps78518qkvurq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (46 pp, sha256
8d1b76473f2a1cce, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).