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TPS75218QPWPR

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Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, HTSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TPS75218QPWPR

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · HTSSOP-20

TPS75218QPWPR from Texas Instruments, in a HTSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND/HEATSINK power_in Ground/heatsink terminal connected directly to the mount pad for thermal-enhanced operation; it may be connected to GND or left floating.
2 NC unconnected Not connected.
3 IN power_in Input voltage; the datasheet's absolute maximum input voltage range (VIN) is -0.3 V to +6 V.
4 IN power_in Input voltage; the datasheet's absolute maximum input voltage range (VIN) is -0.3 V to +6 V.
5 EN input Negative-polarity enable input: the device is enabled when EN is at logic low and shuts down when EN is at logic high (absolute maximum voltage at EN is -0.3 V to +16.5 V).
6 RESET/PG output Open-drain active-low RESET output on TPS752xxQ (maximum voltage 16.5 V); it goes high-impedance 100 ms after VOUT reaches 95% of its regulated voltage and requires a pullup resistor.
7 FB/SENSE input Sense input for fixed-output options, which must be connected to the regulator output as short as possible to minimize noise pickup (FB is the feedback input on the adjustable version only).
8 OUTPUT power_out Regulated output voltage; a minimum 47 µF output capacitor with ESR between 100 mΩ and 10 Ω is required for stability.
9 OUTPUT power_out Regulated output voltage; a minimum 47 µF output capacitor with ESR between 100 mΩ and 10 Ω is required for stability.
10 GND/HEATSINK power_in Ground/heatsink terminal connected directly to the mount pad for thermal-enhanced operation; it may be connected to GND or left floating.
11 GND/HEATSINK power_in Ground/heatsink terminal connected directly to the mount pad for thermal-enhanced operation; it may be connected to GND or left floating.
12 NC unconnected Not connected.
13 NC unconnected Not connected.
14 NC unconnected Not connected.
15 NC unconnected Not connected.
16 NC unconnected Not connected.
17 GND power_in Ground.
18 NC unconnected Not connected.
19 NC unconnected Not connected.
20 GND/HEATSINK power_in Ground/heatsink terminal connected directly to the mount pad for thermal-enhanced operation; it may be connected to GND or left floating.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20
Category Power Management (PMIC)
Pins 21

CAD (KiCad official)

  • Symbol: TPS75218QPWPR
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps75218qpwpr-etched.step / tps75218qpwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps75218qpwpr.step / tps75218qpwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (33 pp, sha256 ddac75f3b3fd04bf, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF