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TPS74901RGWT

Texas Instruments · Linear Voltage Regulators (LDO) · VQFN-20-EP(5x5)

TPS74901RGWT from Texas Instruments, in a VQFN-20-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2µF, ceramic) is needed from this pin to ground to assure stability.
2 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
3 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
4 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
5 IN input Unregulated input to the device; the recommended input supply voltage is up to 5.5 V and the absolute maximum is 6 V.
6 IN input Unregulated input to the device; the recommended input supply voltage is up to 5.5 V and the absolute maximum is 6 V.
7 IN input Unregulated input to the device; the recommended input supply voltage is up to 5.5 V and the absolute maximum is 6 V.
8 IN input Unregulated input to the device; the recommended input supply voltage is up to 5.5 V and the absolute maximum is 6 V.
9 PG output Power-good (PG) is an open-drain, active-high output that indicates the status of VOUT; it requires a pullup resistor from 10kΩ to 1MΩ to a supply up to 5.5V.
10 BIAS input Bias input voltage for error amplifier, reference, and internal control circuits; it must be at least VOUT + VDO(VBIAS) and at least 2.7 V, with a maximum of 5.5 V.
11 EN input Enable pin. Driving this pin high enables the regulator. Driving this pin low puts the regulator into shutdown mode. This pin must not be left floating.
12 GND power_in Ground reference for the regulator.
13 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
14 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
15 SS passive Soft-start pin. A capacitor connected on this pin to ground sets the start-up time. If this pin is left floating, the regulator output soft-start ramp time is typically 100µs.
16 FB input Feedback connection to the center tap of an external resistor divider network that sets the output voltage. This pin must not be left floating.
17 NC unconnected No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
18 OUT output Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2µF, ceramic) is needed from this pin to ground to assure stability.
19 OUT output Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2µF, ceramic) is needed from this pin to ground to assure stability.
20 OUT output Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2µF, ceramic) is needed from this pin to ground to assure stability.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-20-EP(5x5)
Category Power Supply Chip
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (RGW and SON packages), legacy chip VOUT -2 0.5 2 % VOUT + 2.2V ≤ VBIAS ≤ 5.5 V, 50mA ≤ IOUT ≤ 3A (Legacy Chip) 5
Output voltage accuracy (RGW and SON packages), new chip VOUT -1 0.3 1 % VOUT + 2.2V ≤ VBIAS ≤ 5.5V, 50mA ≤ IOUT ≤ 3A (New Chip) 5
VIN dropout voltage, legacy chip VDO 120 280 mV IOUT = 3A, VBIAS, VOUT(nom) ≥ 3.25V (Legacy Chip) 5
VIN dropout voltage, new chip VDO 120 200 mV IOUT = 3A, VBIAS, VOUT(nom) ≥ 3.25V (New Chip) 5
VBIAS dropout voltage, legacy chip 1.31 1.75 V IOUT = 3A, VIN = VBIAS (Legacy Chip) 5
VBIAS dropout voltage, new chip 1.45 1.6 V IOUT = 3A, VIN = VBIAS (New Chip) 5
Current limit, RGW package ICL 3.9 4.6 5.5 A VOUT = 80% × VOUT(nom), RGW Package 5
BIAS pin current, legacy chip IBIAS 1 2 mA Legacy Chip 5
BIAS pin current, new chip IBIAS 1 1.2 mA New Chip 5
Shutdown supply current (IGND), legacy chip ISHDN 1 50 µA VEN ≤ 0.4V (Legacy Chip) 5
Shutdown supply current (IGND), new chip ISHDN 0.85 2.75 µA VEN ≤ 0.4V, VIN = VBIAS = 5.5V (New Chip) 5
Feedback pin current, legacy chip IFB -1 0.15 1 µA Legacy Chip 6
Feedback pin current, new chip IFB -30 0.15 30 nA New Chip 6
Enable input high level VEN(hi) 1.1 5.5 V 6
Enable input low level VEN(lo) 0 0.4 V 6
Enable pin current, legacy chip IEN 0.1 1 µA VEN = 5V (Legacy Chip) 6
Enable pin current, new chip IEN 0.1 0.25 µA VEN = 5V (New Chip) 6
PG trip threshold VIT 85 90 94 %VOUT VOUT decreasing 6
PG output low voltage, legacy chip VPG(lo) 0.3 V IPG = 1mA (sinking), VOUT < VIT (Legacy Chip) 6
PG output low voltage, new chip VPG(lo) 0.12 V IPG = 1mA (sinking), VOUT < VIT (New Chip) 6
PG leakage current, legacy chip IPG(lkg) 0.1 1 µA VPG = 5.25V, VOUT > VIT (Legacy Chip) 6
PG leakage current, new chip IPG(lkg) 0.001 0.05 µA VPG = 5.25V, VOUT > VIT (New Chip) 6
Operating junction temperature TJ -40 125 ℃ 6
Thermal shutdown temperature, shutdown (temperature increasing) TSD 165 ℃ Shutdown, temperature increasing 6
Thermal shutdown temperature, reset (temperature decreasing) TSD 140 ℃ Reset, temperature decreasing 6
Input supply voltage VIN 5.5 V VOUT + VDO (VIN) to 5.5 V 4
Enable supply voltage VEN 5.5 V 4
BIAS supply voltage VBIAS 5.5 V VOUT + VDO (VBIAS) to 5.5 V; BIAS supply required when VIN is below VOUT + 1.62 V 4
Output voltage VOUT 0.8 3.6 V 4
Output current IOUT 0 3 A 4
Output capacitor COUT 2.2 µF 4
Input capacitor CIN 1 µF 4
Bias capacitor CBIAS 0.1 1 µF 4
VIN, VBIAS input voltage VIN, VBIAS -0.3 6 V 4
Enable voltage VEN -0.3 6 V 4
Power-good voltage VPG -0.3 6 V 4
PG sink current IPG 0 1.5 mA 4
Soft-start voltage VSS -0.3 6 V 4
Feedback voltage VFB -0.3 6 V 4
Junction temperature TJ -40 150 °C 4
Storage temperature Tstg -55 150 °C 4
Junction-to-ambient thermal resistance, RGW (VQFN), 20 pins RθJA 38.1 °C/W RGW (VQFN) 20 pins 5
Junction-to-ambient thermal resistance, RGW (VQFN), new chip RθJA 34.7 °C/W RGW (VQFN) (2) New Chip 5
Junction-to-case (top) thermal resistance, RGW (VQFN) RθJC(top) 36.3 °C/W RGW (VQFN) 20 pins 5
Junction-to-board thermal resistance, RGW (VQFN) RθJB 17.5 °C/W RGW (VQFN) 20 pins 5
Junction-to-case (bottom) thermal resistance, RGW (VQFN) RθJC(bot) 6.2 °C/W RGW (VQFN) 20 pins 5

CAD (KiCad official)

  • Symbol: TPS74901RGWT
  • Footprint: Package_DFN_QFN:QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
  • 3D model: VQFN-20-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps74901rgwt-etched.step / tps74901rgwt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps74901rgwt.step / tps74901rgwt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (47 pp, sha256 bf8af2cd98671dc1, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF