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TPS74528PQWDRVRQ1
Public Made by Adomby adom
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, WSON-6-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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TPS74528PQWDRVRQ1
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · WSON-6-EP(2x2)
TPS74528PQWDRVRQ1 from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin that requires a capacitor from OUT to ground for stability, with a ceramic COUT of 1 µF or larger recommended (1 µF to 220 µF range, minimum derated 0.47 µF). |
| 2 | NC | unconnected | No internal connection; ground this pin for better thermal performance. |
| 3 | GND | power_in | Ground pin, electrically connected to the thermal pad and GND node. |
| 4 | EN | input | Enable pin: drive EN greater than VEN(HI) to turn on the regulator and less than VEN(LO) to put the LDO into shutdown, with VEN rated from 0 V to 6.0 V. |
| 5 | PG | output | Open-drain power-good output with a 150-µs delay that requires a pull-up resistor; ground or leave floating if power-good is not used, with VPG rated from 0 V to 6.0 V. |
| 6 | IN | power_in | Input supply pin that requires the recommended ceramic capacitor (CIN minimum 1 µF) from IN to ground, with VIN rated from 1.5 V to 6.0 V. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VIN | -0.3 | 6.5 | V | 4 | ||
| Enable voltage | VEN | -0.3 | 6.5 | V | 4 | ||
| Power-good voltage | VPG | -0.3 | 6.5 | V | 4 | ||
| Output voltage | VOUT | -0.3 | V | Max = VIN + 0.3 V or 6.0 V, whichever is smaller | 4 | ||
| Power-good current | IPG | -10 | 10 | mA | 4 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Input voltage | VIN | 1.5 | 6 | V | 4 | ||
| Output voltage (fixed only) | VOUT | 0.65 | 5 | V | Fixed only | 4 | |
| Output current | IOUT | 0 | 500 | mA | 4 | ||
| Output capacitor | COUT | 1 | 220 | µF | Minimum derated capacitance of 0.47 µF is required for stability (footnote 1) | 4 | |
| Enable voltage | VEN | 0 | 6 | V | 4 | ||
| PG voltage | VPG | 0 | 6 | V | 4 | ||
| Junction operating temperature | TJ | -40 | 150 | °C | 4 | ||
| Output accuracy | -0.85 | 0.85 | % | TJ = 25°C | 5 | ||
| Output accuracy | -1 | 1 | % | -40°C ≤ TJ ≤ 85°C | 5 | ||
| Output accuracy | -1.5 | 1.5 | % | -40°C ≤ TJ ≤ 150°C | 5 | ||
| Line regulation | 2 | 7.5 | mV | VOUT(NOM) + 0.5 V ≤ VIN ≤ 6.0 V | 5 | ||
| Load regulation | 0.03 | V/A | 0.1 mA ≤ IOUT ≤ 500 mA, VIN ≥ 2.0 V | 5 | |||
| Ground current | IGND | 25 | 32 | µA | IOUT = 0 mA, TJ = 25°C | 5 | |
| Ground current | IGND | 25 | 36 | µA | IOUT = 0 mA, -40°C ≤ TJ ≤ 150°C | 5 | |
| Shutdown current | ISHDN | 0.1 | 1 | µA | VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V, -40°C ≤ TJ ≤ 125°C | 5 | |
| Shutdown current | ISHDN | 0.1 | 1.55 | µA | VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V, -40°C ≤ TJ ≤ 150°C | 5 | |
| Output current limit | ICL | 515 | 720 | 865 | mA | VOUT(NOM) < 1.0 V: VOUT = VOUT(NOM) - 0.2 V, VIN = 2.0 V; VOUT(NOM) ≥ 1.0 V: VOUT = VOUT(NOM) x 0.85, VIN = VOUT(NOM) + 1.0 V | 5 |
| Short-circuit current limit | ISC | 200 | 350 | 400 | mA | VOUT = 0 V; VOUT(NOM) < 1.0 V: VIN = 2.0 V; VOUT(NOM) ≥ 1.0 V: VIN = VOUT(NOM) + 1.0 V | 5 |
| Dropout voltage | VDO | 105 | 170 | mV | IOUT = 500 mA, VOUT = 0.95 × VOUT(NOM), 2.5 V ≤ VOUT < 3.3 V | 5 | |
| Undervoltage lockout (VIN falling) | VUVLO | 1.17 | 1.3 | 1.42 | V | VIN falling | 5 |
| Undervoltage lockout (VIN rising) | VUVLO | 1.21 | 1.34 | 1.47 | V | VIN rising | 5 |
| Startup time | tSTR | 200 | 500 | 650 | µs | From EN low-to-high transition to VOUT = VOUT(NOM) x 0.95 | 6 |
| EN pin high voltage (enabled) | VEN(HI) | 1 | V | Enabled | 6 | ||
| EN pin low voltage (disabled) | VEN(LO) | 0.3 | V | Disabled | 6 | ||
| PG high threshold | PGHTH | 89 | 92 | 96 | %VOUT | VOUT increasing | 6 |
| PG low threshold | PGLTH | 86 | 90 | 93 | %VOUT | VOUT decreasing | 6 |
| PG pin low-level output voltage | VOL(PG) | 300 | mV | VIN ≥ 1.5 V, ISINK = 1.0 mA; VIN ≥ 2.75 V, ISINK = 2.0 mA | 6 | ||
| PG pin leakage current | Ilkg(PG) | 7 | 50 | nA | VOUT > PGHTH, VPG = 6.0 V | 6 | |
| PG delay time rising | tPGDH | 135 | 165 | 178 | µs | From 92% VOUT to 20% of PG; output overdrive = 10% | 6 |
| PG delay time falling | tPGDL | 1.5 | 7 | 10 | µs | From 90% VOUT to 80% of PG; output overdrive = 10% | 6 |
| Junction-to-ambient thermal resistance (DRV WSON) | RθJA | 80.3 | °C/W | DRV (6-pin WSON) | 5 | ||
| Junction-to-case (top) thermal resistance (DRV WSON) | RθJC(top) | 98.7 | °C/W | DRV (6-pin WSON) | 5 | ||
| Junction-to-board thermal resistance (DRV WSON) | RθJB | 44.8 | °C/W | DRV (6-pin WSON) | 5 | ||
| Junction-to-top characterization parameter (DRV WSON) | ψJT | 6.1 | °C/W | DRV (6-pin WSON) | 5 | ||
| Junction-to-board characterization parameter (DRV WSON) | ψJB | 45 | °C/W | DRV (6-pin WSON) | 5 | ||
| Junction-to-case (bottom) thermal resistance (DRV WSON) | RθJC(bot) | 20.8 | °C/W | DRV (6-pin WSON) | 5 |
CAD (KiCad official)
- Symbol:
TPS74528PQWDRVRQ1 - Footprint:
Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps74528pqwdrvrq1-etched.step/tps74528pqwdrvrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps74528pqwdrvrq1.step/tps74528pqwdrvrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (48 pp, sha256
434ed7c32560a28e, retrieved 2026-11-05, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).