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Ray tps73047dbvr: specified limits as data (metadata.characteristics, 36 rows from the datasheet) b47768e 17d ago

TPS73047DBVR

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

TPS73047DBVR from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Device input pin that supplies the regulator; the pin table gives only this function, and the input voltage range is specified in the recommended operating conditions.
2 GND power_in Regulator ground reference pin for the device.
3 EN input Active-high enable: driving EN high turns the regulator on and driving it low puts it in shutdown mode; if shutdown is not needed, EN should be tied to IN.
4 NC/NR passive On the old chip this is the noise-reduction pin, where an external capacitor filters bandgap noise; on the new chip it is not internally connected and may be tied to GND to improve thermal performance or left floating.
5 OUT power_out Regulator output pin that delivers the regulated output voltage to the load.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN (recommended operating) VIN 2.7 5.5 V 4
Enable voltage (recommended operating) VEN 0 5.5 V 4
Output current (recommended operating) IOUT 0 200 mA 4
Operating junction temperature (recommended) TJ -40 125 °C 4
Output capacitor COUT COUT 2.2 10 µF Min 4.7 µF if CFF not used or VOUT(nom) < 1.8V; new chip min effective 0.47 µF (notes 1, 2) 4
Input capacitor CIN (old chip) CIN 0.1 1 µF 4
Noise-reduction capacitor CNR (old chip only) CNR 0 10 nF 4
Feedforward capacitor CFF (new chip) CFF 0 10 100 nF 4
Input, enable and output voltage (old chip) VIN, VEN, VOUT -0.3 6 V 4
Input and enable voltage (new chip) VIN, VEN -0.3 6.5 V 4
Output voltage (new chip) VOUT -0.3 V Max printed as VIN + 0.3 (or 6.5 V, whichever is smaller) 4
Operating junction temperature (DBV package) TJ -40 150 °C DBV package 4
Storage temperature Tstg -65 150 °C 4
ESD HBM V(ESD) -2000 2000 V HBM per ANSI/ESDA/JEDEC JS-001, all pins 4
ESD CDM V(ESD) -500 500 V CDM per JEDEC JESD22-C101, all pins 4
Input voltage range VIN 2.7 5.5 V 5
Continuous output current IOUT 0 200 mA 5
Output voltage accuracy -2 2 % 0µA < IOUT < 200mA, VOUT+1V < VIN < 5.5V 5
Dropout voltage VDO 120 210 mV VIN= VOUT - 0.1V, IOUT = 200mA 5
Output current limit (old chip) ICL 285 600 mA VOUT = 0V (old chip) 5
Output current limit (new chip) ICL 320 460 mA IN = VOUT(NOM) + 1V, VOUT = 0.9 x VOUT(NOM) (new chip only) 5
Quiescent (GND) current (old chip) IGND 170 220 µA 0µA ≤ IO ≤ 200mA (old chip) 5
Quiescent (GND) current (new chip) IGND 250 1000 µA 0µA ≤ IO ≤ 200mA (new chip) 5
Shutdown current (old chip) ISHDN 0.07 1 µA VEN = 0V, 2.7V < VIN < 5.5V (old chip) 5
Shutdown current (new chip) ISHDN 0.01 1 µA VEN = 0V, 2.7V < VIN < 5.5V (new chip) 5
High-level enable input voltage (old chip) VEN(HI) 1.7 V 2.7V ≤ VIN ≤ 5.5V 6
Low-level enable input voltage (old chip) VEN(LOW) 0 0.7 V 2.7V ≤ VIN ≤ 5.5V 6
Low-level enable input voltage (new chip) VEN(LOW) 0 0.425 V 2.7V ≤ VIN ≤ 5.5V (new chip) 6
Enable pin current IEN -1 1 µA VEN = 0V 6
UVLO threshold, VIN rising (old chip) VUVLO 2.25 2.65 V VIN rising (old chip) 6
UVLO threshold, VIN rising (new chip) VUVLO 1.32 1.6 V VIN rising (new chip) 6
Junction-to-ambient thermal resistance (DBV SOT-23-5, new chip) RθJA 182.3 °C/W 5
Junction-to-case (top) thermal resistance (DBV SOT-23-5, new chip) RθJC(top) 114.8 °C/W 5
Junction-to-board thermal resistance (DBV SOT-23-5, new chip) RθJB 79.1 °C/W 5
Junction-to-top characterization parameter (DBV SOT-23-5, new chip) ψJT 56.8 °C/W 5
Junction-to-board characterization parameter (DBV SOT-23-5, new chip) ψJB 78.8 °C/W 5

CAD (KiCad official)

  • Symbol: TPS73047DBVR
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: tps73047dbvr-etched.step / tps73047dbvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps73047dbvr.step / tps73047dbvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 14439297a4ab9a2b, retrieved 2026-10-09, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF