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Ray tps72009qdrvrq1: specified limits as data (metadata.characteristics, 37 rows from the datasheet) a09a31d 25d ago

TPS72009QDRVRQ1

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · WSON-6-EP(2x2)

TPS72009QDRVRQ1 from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Output pin; a 2.2-µF ceramic capacitor connected from this pin to ground is required for stability and load transients.
2 NC unconnected No connection.
3 EN input Enable pin; a logic high turns the device on and regulates the voltage from IN to OUT, and a logic low turns it off.
4 BIAS input Bias supply pin; TI recommends bypassing this input with a ceramic capacitor to ground for better transient performance.
5 GND power_in Ground pin.
6 IN input Input pin; it can be a maximum of 4.5 V, VIN must not exceed VBIAS, and it should be bypassed with a ceramic capacitor to ground.
7 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-6-EP(2x2)
Category Power Management (PMIC)
Pins 7

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 1.1 V 5
Bias voltage VBIAS 2.6 5.5 V 5
Output voltage VOUT 0.9 3.6 V 5
Output accuracy -2 2 % Over VBIAS, VIN, IOUT, TJ = -40°C to +125°C; VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V, VOUT + 0.5 V ≤ VIN ≤ 4.5 V, 0 mA ≤ IOUT ≤ 350 mA 5
Output accuracy (VOUT < 1.2 V) -25 25 mV Over VBIAS, VIN, IOUT, TJ = -40°C to +125°C; VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V, VOUT + 0.5 V ≤ VIN ≤ 4.5 V, 0 mA ≤ IOUT ≤ 350 mA, VOUT < 1.2 V 5
Output accuracy (VIN floating) -1 1 % VIN floating; VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V, 0 μA ≤ IOUT ≤ 500 μA 5
VIN line transient -200 200 μV ΔVIN = 400 mV, tRISE = tFALL = 1 μs 5
VBIAS line transient -0.8 0.8 mV ΔVBIAS = 600 mV, tRISE = tFALL = 1 μs 5
Load transient -15 15 mV 0 mA ≤ IOUT ≤ 350 mA, tRISE = tFALL = 1 μs 5
Output current limit ICL 420 600 800 mA VOUT = 0.9 × VOUT(NOM) 5
Ground pin current IGND 54 80 μA IOUT = 0 mA to 350 mA 5
Shutdown current (IGND) ISHDN 0.5 2.5 μA VEN ≤ 0.4 V 5
Enable pin high (enabled) VEN(HI) 1.1 V 5
Enable pin low (disabled) VEN(LO) 0 0.4 V 5
Undervoltage lockout 2.35 2.45 2.59 V VBIAS rising 6
Operating junction temperature (electrical characteristics) TJ -40 125 °C 6
Input voltage (steady-state, absolute max) VIN -0.3 V Maximum is VBIAS or 5 V, whichever is less 3
Peak transient input voltage VIN_PEAK 5.5 V Each transient ≤1 ms, ≤1000 occurrences over device lifetime 3
Bias voltage (absolute max) VBIAS -0.3 6 V 3
Enable voltage (absolute max) VEN -0.3 6 V 3
Output voltage (absolute max) VOUT -0.3 5 V 3
Operating junction temperature (absolute max) TJ -55 125 °C 3
Storage temperature Tstg -55 150 °C 3
Input voltage (steady-state, recommended) VIN 1.1 V Maximum is VBIAS or 4.5 V (footnote 1) 4
Bias voltage (recommended) VBIAS 5.5 V Minimum is 2.6 V or VOUT + 1.4 V, whichever is greater (footnote 2) 4
Output voltage (recommended) VOUT 0.9 3.6 V 4
Peak output current (recommended) IOUT 0 350 mA 4
Enable voltage (recommended) VEN 0 5.5 V 4
Input capacitance CIN 1 µF 4
Bias capacitance CBIAS 0.1 µF 4
Output capacitance COUT 2.2 µF Maximum ESR must be less than 250 mΩ 4
Junction-to-ambient thermal resistance RθJA 66.5 °C/W DRV (WSON) 6-pin, JEDEC board 4
Junction-to-case (top) thermal resistance RθJC(top) 86.2 °C/W DRV (WSON) 6-pin 4
Junction-to-board thermal resistance RθJB 36.1 °C/W DRV (WSON) 6-pin 4
Junction-to-top characterization parameter ψJT 1.7 °C/W DRV (WSON) 6-pin 4
Junction-to-board characterization parameter ψJB 36.6 °C/W DRV (WSON) 6-pin 4
Junction-to-case (bottom) thermal resistance RθJC(bot) 7.4 °C/W DRV (WSON) 6-pin 4

CAD (KiCad official)

  • Symbol: TPS72009QDRVRQ1
  • Footprint: Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
  • 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: tps72009qdrvrq1-etched.step / tps72009qdrvrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps72009qdrvrq1.step / tps72009qdrvrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 1f171499f63bd1ce, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF